A3PE3000L-FGG484I

The A3PE3000L-FGG484I is a ProASIC3L field programmable gate array (FPGA) IC designed for industrial applications requiring substantial logic capacity and flexible I/O. It combines a large number of logic elements with embedded memory and a high I/O count, delivering integration suited to control, interface, and processing tasks.

Key attributes include 75,264 logic elements, approximately 0.516 Mbits of embedded memory, 341 I/O pins, and a low-voltage supply range of 1.14 V to 1.575 V, all in a compact 484-ball BGA package rated for -40 °C to 100 °C operation.

Key Features

• Core Logic: 75,264 logic elements providing extensive programmable fabric for implementing complex digital functions and custom logic networks.
• Embedded Memory: Approximately 0.516 Mbits of on-chip RAM (516,096 bits) for data buffering, state storage, and small memory blocks within designs.
• Logic Capacity: 3,000,000 gates enabling integration of sizable functional blocks and state machines on a single device.
• I/O Capability: 341 general-purpose I/O pins to support dense interfacing, parallel buses, and multiple peripheral connections.
• Power and Voltage: Supports a supply voltage range from 1.14 V to 1.575 V suitable for low-voltage system domains.
• Package and Mounting: 484-ball FPBGA (23 × 23) package in a surface-mount format for compact board integration and high pin density.
• Temperature and Grade: Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance: RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control and Automation: Implement custom control logic, sequencing, and interface aggregation in industrial systems that require industrial-grade temperature capability.
• High-Density I/O Bridging: Manage multiple parallel signals and protocol conversion tasks using the device’s 341 I/O pins and sizable logic resources.
• Embedded Logic and Acceleration: Offload deterministic processing and hardware-accelerated functions into the FPGA fabric using its 75,264 logic elements and embedded RAM.
• Low-Voltage System Integration: Integrate into modern low-voltage platforms leveraging the device’s 1.14 V to 1.575 V supply range.

Unique Advantages

• High Logic Density: 75,264 logic elements enable consolidation of multiple functions on a single device, reducing board-level complexity.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM supports buffering and state retention without external memory.
• Large I/O Count: 341 I/O pins provide flexibility for complex interfacing, sensor arrays, or multi-channel systems.
• Compact, High-Pin Package: 484-ball FPBGA (23 × 23) delivers high pin count in a compact surface-mount footprint for space-constrained designs.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for reliable operation in harsh or variable-temperature environments.
• RoHS Compliant: Meets common environmental manufacturing requirements to simplify supply-chain compliance.

Why Choose A3PE3000L-FGG484I?

The A3PE3000L-FGG484I provides a balance of substantial programmable logic, embedded memory, and high I/O capacity in a compact BGA package tailored for industrial applications. Its low-voltage operation and broad operating temperature range make it suitable for designs that require both integration density and reliable field performance.

This device is a practical choice for engineering teams building control systems, I/O-heavy interfaces, or hardware-accelerated logic where consolidation and board-space efficiency are key. The combination of logic resources, on-chip memory, and industrial-grade specifications delivers long-term value through simplified designs and scalable system integration.

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