A3PE600-1FG256

The A3PE600-1FG256 is a ProASIC3E field programmable gate array (FPGA) offered in a 256-LBGA package. It provides 600,000 gates, 13,824 logic elements and 110,592 bits of on-chip RAM with 165 programmable I/O pins.

Targeted for commercial embedded designs, the device operates from a 1.425 V to 1.575 V core supply and over a 0 °C to 85 °C temperature range. Its package and I/O density suit applications that require moderate logic capacity and significant pin count in a surface-mount form factor.

Key Features

• Core Capacity  13,824 logic elements and 600,000 gates provide the programmable logic resources needed for moderate-complexity designs.
• Embedded Memory  110,592 bits of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O Density  165 programmable I/O pins to support multiple interfaces and peripheral connectivity.
• Power Supply  Specified core voltage range of 1.425 V to 1.575 V for consistent supply planning.
• Package and Mounting  256-LBGA package (supplier package: 256-FPBGA 17×17) in a surface-mount footprint for compact board integration.
• Operating Range & Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Embedded Systems  Used where a mid-range FPGA is required for glue logic, protocol handling, and custom control functions with up to 165 I/Os.
• Communication Interfaces  Suitable for designs that need programmable logic combined with significant I/O count for implementing interface bridging or protocol adaptation.
• Instrumentation and Test Equipment  Provides on-chip RAM and logic density for data capture, preprocessing and custom timing/control in test systems.
• Prototyping and System Integration  Useful for developers implementing and validating medium-complexity logic functions in a compact LBGA package.

Unique Advantages

• Substantial Logic Capacity: 13,824 logic elements and 600,000 gates allow integration of multiple functions into a single FPGA, reducing external component count.
• On-chip Memory: 110,592 bits of embedded RAM supports local buffering and small lookup tables without external memory.
• High I/O Count: 165 I/Os provide flexible connectivity for multi-interface designs and peripheral expansion.
• Compact Surface-Mount Package: 256-LBGA (256-FPBGA 17×17) provides a high-density footprint for space-constrained PCBs.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match typical commercial application environments.
• RoHS Compliant: Meets RoHS requirements for environmental and regulatory considerations.

Why Choose A3PE600-1FG256?

The A3PE600-1FG256 positions itself as a mid-range ProASIC3E FPGA that balances logic capacity, on-chip memory, and I/O density in a compact 256-LBGA package. Its specifications—600,000 gates, 13,824 logic elements, 110,592 bits of RAM and 165 I/Os—make it well suited for commercial embedded designs that require programmable logic integration without excessive board area.

Designers seeking a commercially graded FPGA with defined supply and operating temperature ranges will find this device appropriate for consolidating discrete logic, implementing custom interfaces, and reducing bill-of-materials in medium-complexity electronic systems.

Request a quote or submit a pricing inquiry to obtain availability and ordering information for the A3PE600-1FG256.