A3PE600-FGG256I

IC FPGA 165 I/O 256FBGA
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 165 110592 256-LBGA

Quantity 943 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O165Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of A3PE600-FGG256I – ProASIC3E Field Programmable Gate Array (FPGA) IC 165 110592 256-LBGA

The A3PE600-FGG256I is a ProASIC3E Field Programmable Gate Array (FPGA) offering a balance of logic capacity, I/O density and embedded memory in a compact 256-LBGA package. It integrates 13,824 logic elements (approximately 600,000 equivalent gates) and approximately 0.11 Mbits of on-chip RAM to support a wide range of programmable logic implementations.

Designed for industrial-grade deployments, the device operates from a 1.425 V to 1.575 V supply and is specified for an operating temperature range of −40 °C to 100 °C. The part is RoHS compliant and provided in a surface-mount 256-FPBGA (17×17) package.

Key Features

  • Core Logic  13,824 logic elements enable complex programmable logic designs with a reported equivalence of 600,000 gates.
  • Embedded Memory  Approximately 0.11 Mbits of on-chip RAM for local storage and buffering within user logic.
  • I/O Density  Up to 165 general-purpose I/O pins to support a variety of external interfaces and signal routing requirements.
  • Power Supply  Operates from a defined core supply range of 1.425 V to 1.575 V for stable power-domain design.
  • Package & Mounting  256-LBGA (supplier package 256-FPBGA, 17×17) in a surface-mount form factor for compact board integration.
  • Industrial Temperature Grade  Specified for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
  • Environmental Compliance  RoHS compliant for adherence to lead-free manufacturing and assembly requirements.

Unique Advantages

  • Significant logic capacity: 13,824 logic elements provide substantial programmable resources for mid-density FPGA designs, reducing the need for external glue logic.
  • Compact, high-pin package: 165 I/Os in a 256-LBGA package allow dense connectivity in space-constrained PCBs.
  • Embedded memory available: Approximately 0.11 Mbits of on-chip RAM supports local buffering and state storage within user logic.
  • Industrial operating range: −40 °C to 100 °C rating supports deployment in harsher environments where wider temperature tolerance is required.
  • Controlled core supply: Specified 1.425 V to 1.575 V supply window enables predictable power design and domain planning.
  • RoHS compliant and surface-mount: Facilitates modern manufacturing processes and regulatory compliance.

Why Choose A3PE600-FGG256I?

The A3PE600-FGG256I positions itself as an industrial-grade ProASIC3E FPGA option for designers who need a mid-density programmable device with substantial logic resources, embedded RAM, and a high I/O count in a compact BGA package. Its defined voltage supply and wide operating temperature range make it suitable for designs where environmental tolerance and predictable power behavior are important.

This part is well suited to engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA offering clear, verifiable specifications for logic capacity, I/O availability, package type and operating conditions.

Request a quote or submit a purchase inquiry for the A3PE600-FGG256I to receive pricing and availability information.

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