A3PE600L-1FG484M

The A3PE600L-1FG484M is a ProASIC3EL field programmable gate array (FPGA) designed for applications requiring substantial logic capacity and robust environmental capability. It delivers 600,000 gates across 13,824 logic elements with approximately 110,592 bits of embedded memory and 270 user I/O pins in a 484-BGA (23x23) surface-mount package.

Engineered and qualified for military use (MIL-STD-883), this FPGA supports operation over a wide temperature range (−55 °C to 125 °C) and a nominal supply range of 1.425 V to 1.575 V, making it suitable for high-reliability and harsh-environment embedded designs.

Key Features

• Core Capacity 600,000 gates and 13,824 logic elements provide substantial programmable logic resources for complex designs.
• Embedded Memory Approximately 110,592 bits of on‑chip RAM to support data buffering, state storage, and small embedded memories without external components.
• I/O Resources 270 user I/O pins enable high connectivity for interfaces, sensors, and peripheral devices.
• Package 484-BGA (484-FPBGA, 23x23) surface-mount package suitable for compact board layouts with high pin density.
• Power Operates from a supply voltage range of 1.425 V to 1.575 V to match system power rails.
• Qualification & Grade Military grade with MIL-STD-883 qualification, intended for defense and other high-reliability applications.
• Temperature Range Specified operation from −55 °C to 125 °C for use in extreme-temperature environments.
• RoHS Compliant Meets RoHS requirements for lead‑free manufacturing and assembly.

Typical Applications

• Defense & Aerospace Systems High logic capacity and MIL-STD-883 qualification make this FPGA suitable for mission-critical subsystems and secure communications hardware.
• Rugged Embedded Controllers Wide operating temperature and robust package enable deployment in ruggedized control systems and fielded electronics.
• High‑I/O Signal Processing Large I/O count supports complex sensor interfaces, data aggregation, and real-time signal routing in embedded platforms.

Unique Advantages

• High Logic Density: 13,824 logic elements and 600,000 gates allow integration of complex logic functions that reduce the need for multiple discrete devices.
• On‑Chip Memory: Approximately 110,592 bits of embedded RAM reduce external memory requirements and simplify board layouts.
• Designed for Harsh Environments: MIL-STD-883 qualification and −55 °C to 125 °C operating range support long-term operation in extreme conditions.
• Extensive I/O Capability: 270 user I/O pins provide flexibility to interface with multiple peripherals and high-pin-count systems.
• Space-Efficient Package: 484-BGA (23x23) package offers a compact footprint for high-density PCB designs.

Why Choose A3PE600L-1FG484M?

The A3PE600L-1FG484M combines substantial programmable logic, embedded memory, and a high I/O count in a military-qualified package optimized for demanding embedded and defense applications. Its specified supply range and wide operating temperature make it suitable for systems that require deterministic behavior under harsh environmental conditions.

This FPGA is well suited for engineers and procurement teams building high-reliability, space-constrained systems that require significant on-chip logic and memory while meeting MIL-STD-883 qualification standards.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the A3PE600L-1FG484M. Our team can provide technical and procurement details to support your design and sourcing decisions.