A3PE3000L-1PQ208I

The A3PE3000L-1PQ208I is a ProASIC3L field programmable gate array (FPGA) in a 208-BFQFP surface-mount package, designed for industrial applications. It combines high logic capacity with embedded memory and a broad I/O count to support complex custom logic and interfacing tasks.

With 75,264 logic elements, approximately 0.52 Mbits of embedded memory, and support for a wide operating temperature range, this device is suited to equipment-level designs that require substantial on-chip resources and robust thermal performance.

Key Features

• Core Logic – 75,264 logic elements and 3,000,000 gates provide substantial capacity for implementing complex digital functions and custom accelerators.
• Embedded Memory – 516,096 bits of on-chip RAM (approximately 0.52 Mbits) to store data, buffering structures, and small lookup tables without external memory.
• I/O Resources – 147 general-purpose I/O pins to support a wide range of peripheral interfaces and signal connections.
• Power and Voltage – Core supply range of 1.14 V to 1.575 V to match low-voltage system designs.
• Package & Mounting – 208-BFQFP surface-mount package (supplier device package: 208-PQFP, 28 × 28 mm) for compact board integration.
• Industrial Temperature Range – Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance – RoHS compliant for materials and manufacturing practices.

Typical Applications

• Industrial Control & Automation – Implements control logic, signal conditioning, and I/O aggregation while operating across industrial temperature ranges.
• Embedded System Integration – Provides programmable logic and on-chip RAM for custom processing blocks and glue logic in embedded devices.
• Communications & Interface Bridging – Supports protocol conversion and multiple I/O interfaces with its 147 I/O pins and high logic capacity.
• High-density Logic Implementation – Accommodates designs that require up to 3,000,000 gates of combinational and sequential logic.

Unique Advantages

• High Logic Density: 75,264 logic elements and 3,000,000 gates enable large-scale custom logic implementations on a single device, reducing board-level complexity.
• Integrated On-chip Memory: Approximately 0.52 Mbits of embedded RAM minimizes dependence on external memory for many control and buffering tasks.
• Generous I/O Count: 147 I/O pins allow flexible interfacing with sensors, actuators, and peripherals without extensive external multiplexing.
• Industrial-ready Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Compact Surface-mount Package: 208-BFQFP (28 × 28 mm) balances high pin count with a board-friendly form factor for dense layouts.
• RoHS Compliance: Material compliance aids integration into modern production and regulatory environments.

Why Choose A3PE3000L-1PQ208I?

The A3PE3000L-1PQ208I positions itself as a robust, high-capacity FPGA for industrial and embedded designs that need significant on-chip logic and memory in a compact surface-mount package. Its combination of 75,264 logic elements, approximately 0.52 Mbits of embedded RAM, and 147 I/O pins makes it suitable for complex control, interfacing, and protocol-handling tasks.

Engineers specifying this device benefit from its industrial temperature rating and low-voltage core operation, enabling integration into systems where thermal range and power domain compatibility matter. The A3PE3000L-1PQ208I is a practical choice for designs that require high logic density and flexible I/O while maintaining a compact board footprint.

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