A3PE3000L-1FGG896

The A3PE3000L-1FGG896 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology designed for commercial applications requiring high logic density and extensive I/O. It integrates approximately 75,264 logic elements and about 3,000,000 gates in a surface-mount 896-FBGA (31×31) package.

With roughly 0.516 Mbits of embedded RAM and a wide I/O complement, this device addresses designs that demand consolidated programmable logic, high pin count interfacing, and a compact BGA footprint while operating within a commercial temperature range.

Key Features

• Core and Logic Density — Provides 75,264 logic elements and approximately 3,000,000 gates to support complex programmable logic functions.
• On-chip Memory — Includes a total of 516,096 bits of embedded RAM (approximately 0.516 Mbits) for local buffering, state storage, and small memory blocks.
• High I/O Count — Up to 620 I/O pins enable broad interfacing to peripherals, high-pin-count connectors, and multi-channel systems.
• Package and Mounting — Supplied in an 896-FBGA (31×31) / 896-BGA package designed for surface-mount assembly to minimize board area.
• Supply Voltage Range — Operates from 1.14 V to 1.575 V to match low-voltage system domains.
• Operating Range and Grade — Commercial grade device specified for 0 °C to 85 °C and RoHS compliant for environmental conformity.

Typical Applications

• High-density logic consolidation — Deploy where large numbers of logic elements are needed to integrate multiple functions into a single FPGA.
• High-pin-count interfacing — Use the 620 I/O pins for designs that require many external connections or parallel interfaces.
• Embedded memory tasks — Leverage approximately 0.516 Mbits of on-chip RAM for buffering, small lookup tables, and state machines.

Unique Advantages

• Significant logic capacity: 75,264 logic elements and 3,000,000 gates enable substantial on-chip logic implementation, reducing the need for multiple discrete devices.
• Substantial I/O resources: 620 I/O pins allow flexible partitioning of signals and direct connections to numerous peripherals or high-speed interfaces.
• Compact high-pin package: 896-FBGA (31×31) package delivers high component density for space-constrained PCBs while maintaining a large I/O count.
• Low-voltage operation: Support for 1.14 V to 1.575 V systems enables integration into modern low-voltage designs.
• Commercial-grade specification: Specified for 0 °C to 85 °C and RoHS compliant, suitable for standard commercial electronic products.

Why Choose A3PE3000L-1FGG896?

The A3PE3000L-1FGG896 delivers a high-density, commercial-grade FPGA solution from Microchip Technology that balances logic capacity, embedded memory, and extensive I/O in a single surface-mount 896-FBGA package. Its combination of approximately 75,264 logic elements, ~0.516 Mbits of RAM, and 620 I/O makes it a strong candidate for designs that require consolidated programmable logic and significant interfacing capability.

Choose this device for projects where board space, I/O count, and on-chip logic resources are key considerations. The device’s specified voltage range, operating temperature, and RoHS compliance provide clear, verifiable parameters for commercial product development.

Request a quote or submit an inquiry to begin procurement of the A3PE3000L-1FGG896 and evaluate its fit for your next programmable logic design.