A3PE3000L-1FGG896M

The A3PE3000L-1FGG896M is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology offering 3,000,000 gates and 75,264 logic elements. It provides a high-density programmable fabric with 620 I/Os and approximately 0.52 Mbits of embedded memory.

Designed and qualified for military use, this device is specified for operation from -55°C to 125°C and is MIL-STD-883 qualified, making it suitable for high-reliability and harsh-environment electronic systems that require dense logic, substantial I/O, and robust temperature performance.

Key Features

• Core Logic — 75,264 logic elements and 3,000,000 gates provide significant programmable logic capacity for complex designs.
• Embedded Memory — Total on-chip RAM of 516,096 bits, approximately 0.52 Mbits of embedded memory for buffering, state storage, and small data structures.
• I/O Density — 620 I/O pins enable wide peripheral connectivity and high-pin-count system interfaces.
• Power Supply — Specified operating voltage range of 1.425 V to 1.575 V to match precise system power rails.
• Package & Mounting — 896-BGA (896-FBGA, 31×31) package in a surface-mount form factor for high-density PCB layouts.
• Temperature & Qualification — Operating range from -55°C to 125°C and MIL-STD-883 qualification for military-grade deployments.
• Environmental Compliance — RoHS compliant, supporting lead-free manufacturing and regulatory requirements.

Typical Applications

• Military and Defense Systems — Use in mission-critical electronics where MIL-STD-883 qualification and wide temperature range are required.
• Aerospace and Avionics — High logic density and extensive I/O support complex control, processing, and interface tasks in airborne systems.
• Rugged Embedded Controllers — Suitable for embedded control and data acquisition in harsh-environment platforms due to its operating temperature and qualification.

Unique Advantages

• High Logic Capacity: 3,000,000 gates and 75,264 logic elements enable implementation of large, complex FPGA designs without resorting to multi-chip solutions.
• Substantial I/O Count: 620 I/Os allow direct connection to a wide array of peripherals and parallel interfaces, reducing the need for external translators or expanders.
• Military-Grade Qualification: MIL-STD-883 qualification and a -55°C to 125°C operating range support deployment in demanding, mission-critical environments.
• Dense, Surface-Mount Packaging: 896-BGA (31×31) package provides high pin count in a compact footprint for space-constrained PCBs.
• Regulatory Compliance: RoHS compliance helps streamline lead-free manufacturing and regulatory adherence.

Why Choose A3PE3000L-1FGG896M?

The A3PE3000L-1FGG896M positions itself as a high-density, military-qualified FPGA that balances large programmable logic capacity with extensive I/O and a compact BGA package. Its qualification to MIL-STD-883 and wide operating temperature range make it appropriate for designers targeting robust, long-life systems in harsh environments.

Backed by Microchip Technology, this device is suited for engineers and procurement teams who need a scalable, reliable FPGA building block for military, aerospace, and rugged embedded applications where logic density, I/O capability, and environmental qualification are decisive factors.

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