A3PE3000L-1FGG484M

The A3PE3000L-1FGG484M is a ProASIC3L field-programmable gate array (FPGA) in a 484-ball BGA package designed for applications requiring high logic density and extended environmental range. It delivers 3,000,000 gates, 75,264 logic elements and approximately 0.52 Mbits of embedded memory with 341 user I/Os, making it suitable for demanding military and ruggedized system designs.

Qualified to MIL-STD-883 and rated for operation from −55 °C to 125 °C with a specified supply range of 1.425 V to 1.575 V, this surface-mount FPGA targets designs that require robust qualification and tight electrical specifications.

Key Features

• Core Logic 3,000,000 gates and 75,264 logic elements provide substantial programmable logic capacity for complex digital functions and custom processing pipelines.
• Embedded Memory Approximately 0.52 Mbits of on-chip RAM supports buffering, state storage and local data processing without external memory.
• High I/O Count 341 user I/O pins enable extensive interface options for peripherals, sensors and multi-channel I/O aggregation.
• Package & Mounting 484-ball FPBGA package (484-FPBGA, 23×23) in a surface-mount form factor balances high pin count with a compact PCB footprint.
• Electrical Specification Specified supply voltage range of 1.425 V to 1.575 V allows precise power budgeting and predictable device behavior within that window.
• Qualification & Grade Military grade with MIL-STD-883 qualification supports use in applications with formal military test requirements.
• Extended Temperature Range Rated for operation from −55 °C to 125 °C to support deployment in thermally challenging environments.
• RoHS Compliant Conforms to RoHS environmental requirements for lead-free assembly and regulatory compatibility.

Typical Applications

• Military & Aerospace Systems — Implements mission-critical logic and I/O aggregation in designs that require MIL-STD-883 qualification and extended temperature operation.
• Ruggedized Industrial Control — Provides high-density programmable logic and ample I/Os for motor control, sensor interfacing and industrial communication in harsh environments.
• High-Density Interface Bridging — Serves as a flexible interface hub where many parallel or serial channels must be routed, formatted or managed via programmable logic.

Unique Advantages

• High Logic Density: 3,000,000 gates and 75,264 logic elements enable implementation of complex state machines, datapaths or custom accelerators on a single device.
• Substantial On-Chip Memory: Approximately 0.52 Mbits of embedded RAM reduces dependency on external memory for buffering and local data tasks.
• Extensive I/O Connectivity: 341 user I/Os support multi-channel interfaces and rich peripheral connectivity without additional glue logic.
• Military Qualification: MIL-STD-883 qualification and military grade designation provide documented testability and reliability for defense applications.
• Wide Operating Range: −55 °C to 125 °C rating supports deployment across a wide range of thermal environments.
• Compact, High-Pin Package: 484-FPBGA (23×23) package supplies a high pin count in a space-efficient surface-mount form factor for dense PCB designs.

Why Choose A3PE3000L-1FGG484M?

The A3PE3000L-1FGG484M combines high programmable logic capacity, a large I/O complement and on-chip memory with military-grade qualification and an extended temperature range. These attributes make it well suited for designs that demand robust qualification, significant on-device resources and predictable electrical characteristics.

Engineers building ruggedized, defense or other high-reliability systems will find this ProASIC3L FPGA useful for consolidating functions onto a single, qualified device—simplifying board design while maintaining the performance and environmental tolerance required for long-term deployments.

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