A3PE3000L-1FGG324

The A3PE3000L-1FGG324 is a ProASIC3L family Field Programmable Gate Array (FPGA) IC designed for mid-density programmable logic applications. It provides a balanced combination of logic capacity, on-chip embedded memory and I/O connectivity in a 324-ball BGA package for surface-mount assembly.

With 75,264 logic elements, approximately 0.516 Mbits of embedded memory and 221 I/Os, this device is intended for applications that require substantial programmable logic resources together with a compact package and commercial-temperature operation.

Key Features

• Core Logic  75,264 logic elements (LEs) and approximately 3,000,000 gates enable substantial programmable logic integration for complex designs.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for buffering, state storage and small data structures within the FPGA fabric.
• I/O Capacity  221 I/O pins support multi-interface designs and dense connectivity to external peripherals and systems.
• Power Supply  Operates from 1.14 V to 1.575 V, supporting low-voltage system integration.
• Package & Mounting  324-ball BGA package (supplier device package: 324-FBGA, 19×19) in a surface-mount form factor for compact board-level integration.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• Embedded Systems  Use the FPGA’s 75,264 logic elements and on-chip RAM to implement custom control logic and data handling within compact embedded designs.
• Interface Bridging  The 221 I/Os enable implementation of multi-protocol interface bridges and signal conditioning between diverse peripherals.
• Prototyping and Custom Logic  Suitable for designers developing bespoke logic functions, leveraging substantial gate count and programmable fabric for rapid iteration.
• Communication Subsystems  On-chip RAM and plentiful logic resources can be used for packet buffering, framing or protocol-specific processing in communication modules.

Unique Advantages

• High Logic Density: 75,264 logic elements provide the capacity to integrate complex state machines and datapath logic into a single device, reducing BOM count.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM enables local buffering and storage without external memory, simplifying board design.
• Generous I/O Count: 221 I/Os allow direct connection to multiple peripherals and interfaces, minimizing the need for external I/O expanders.
• Space-Efficient Packaging: The 324-BGA (324-FBGA, 19×19) surface-mount package delivers high pin density in a compact footprint for space-constrained PCBs.
• Low-Voltage Operation: 1.14 V to 1.575 V supply range supports integration into low-voltage systems and modern power architectures.
• RoHS Compliant: Environmentally compliant manufacturing reduces regulatory risk for commercial products.

Why Choose A3PE3000L-1FGG324?

The A3PE3000L-1FGG324 is positioned for designs that require a substantial amount of programmable logic, a moderate amount of embedded memory and a high I/O count within a compact, surface-mount BGA package. Its commercial-temperature rating and RoHS compliance make it suitable for a wide range of commercial embedded and communication applications.

Designers seeking to consolidate discrete logic, reduce board-level complexity and leverage on-chip resources for buffering and control will find this device a practical choice for scalable, reliable implementations where mid-density FPGA resources are required.

Request a quote or submit a parts request to obtain pricing and availability for the A3PE3000L-1FGG324.