A3PE3000L-1FGG324I

The A3PE3000L-1FGG324I is a ProASIC3L family FPGA from Microchip Technology configured as a surface-mount 324-BGA device. It delivers a mid-to-high density programmable logic fabric with 75,264 logic elements, substantial I/O capability, and embedded RAM suitable for industrial-grade designs.

With a broad operating range and standard BGA packaging, this device targets system designs that require significant on-chip logic, high I/O count, and operation across industrial temperature and supply ranges.

Key Features

• Logic Capacity  Provides 75,264 logic elements to implement complex programmable logic and control functions.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM (516,096 total RAM bits) for buffering, state storage, and small-data structures.
• I/O Density  221 I/O pins to support diverse peripheral connections and system interfacing needs.
• Gate Count  Approximately 3,000,000 gates for substantial functional integration within a single device.
• Power  Operates from a core supply range of 1.14 V to 1.575 V to match system power designs.
• Package and Mounting  324-ball FBGA (19 × 19) package in a surface-mount configuration for compact, board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Compliance  RoHS compliant, supporting environmentally conscious assembly and maintenance.

Typical Applications

• Industrial control and automation  Industrial-grade temperature rating and high logic capacity accommodate control logic, sequencing, and I/O aggregation in factory and process systems.
• High-density I/O systems  221 I/O pins enable designs that require many external connections, such as interface concentrators or protocol bridging modules.
• Embedded logic consolidation  Large gate and logic element counts allow consolidation of multiple discrete functions into a single FPGA to reduce BOM and board complexity.
• Compact, surface-mount designs  324-FBGA package supports space-constrained PCBs where high integration is required.

Unique Advantages

• High integration density: 75,264 logic elements and ~3,000,000 gates let you implement complex logic and reduce external component count.
• On-chip memory for local buffering: Approximately 0.52 Mbits of embedded RAM supports state machines, FIFOs, and small data stores without external memory.
• Extensive I/O capability: 221 I/O pins provide flexibility for interfacing to numerous peripherals and signals directly on-chip.
• Industrial-temperature operation: Rated from −40 °C to 100 °C for deployment in thermally demanding environments.
• Compact BGA packaging: 324-FBGA (19 × 19) in a surface-mount form factor enables dense PCB layouts and reliable board-level mounting.
• RoHS compliant: Conforms to environmental assembly requirements for lead-free production processes.

Why Choose A3PE3000L-1FGG324I?

The A3PE3000L-1FGG324I positions itself as a robust, industrial-grade FPGA option for designers who need a balance of high logic capacity, significant I/O, and on-chip memory in a compact surface-mount package. Its operating voltage range and extended temperature rating make it suitable for demanding embedded applications where consolidation and reliability are important.

This device is appropriate for engineering teams building mid- to high-complexity programmable logic solutions that benefit from substantial gate count, abundant I/O, and embedded RAM—delivering long-term value through integration and board-level simplicity.

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