A3PE3000L-1FG896

The A3PE3000L-1FG896 is a field-programmable gate array (FPGA) from Microchip Technology's ProASIC3L family, delivered in an 896-ball BGA package. It provides substantial programmable logic resources and I/O capacity for commercial electronic designs that require reprogrammable logic and board-level integration.

With a logic capacity of 3,000,000 gates, 75,264 logic elements and extensive I/O, this device targets applications where dense logic implementation, moderate embedded memory and a compact surface-mount package are required. Its supply voltage range and commercial operating temperature make it suitable for standard commercial environments.

Key Features

• Logic Capacity — 3,000,000 gates and 75,264 logic elements provide significant on-chip logic resources for complex programmable designs.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM (516,096 bits) to support buffering, state storage and small data structures within the FPGA fabric.
• I/O Density — 620 available I/O pins to accommodate high-pin-count interfaces and multiple peripheral connections on a single device.
• Power Supply — Operates from a core voltage supply range of 1.14 V to 1.575 V, enabling compatibility with low-voltage design environments.
• Package & Mounting — Supplied in an 896-BGA package (supplier package: 896-FBGA (31×31)), optimized for surface-mount assembly on modern PCBs.
• Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for use in products requiring restricted substance compliance.

Typical Applications

• General-purpose programmable logic — Implement custom combinational and sequential logic for commercial electronics using the device’s 75,264 logic elements and 3,000,000 gates.
• I/O-intensive designs — Leverage 620 I/O pins for boards that integrate many sensors, peripherals or parallel interfaces without multiple ICs.
• Embedded buffering and control — Use the on-chip RAM (approximately 0.516 Mbits) for small buffers, FIFOs or control-state storage within embedded systems.
• Compact, surface-mount systems — The 896-BGA package supports high-density PCB layouts where space and board-level integration matter.

Unique Advantages

• High logic density: 3,000,000 gates and 75,264 logic elements allow substantial functionality to be integrated into a single FPGA, reducing the need for multiple devices.
• Extensive I/O capability: 620 I/O pins support broad connectivity options, simplifying board design for systems with many interfaces.
• On-chip memory resources: Approximately 0.516 Mbits of embedded RAM provide local data storage for buffering and state machines, improving data-path efficiency.
• Compact BGA package: The 896-BGA (896-FBGA (31×31)) enables high pin-count in a surface-mount form factor suited to dense PCB designs.
• Commercial-grade readiness: Designed for 0 °C to 85 °C operation and RoHS compliance, making it appropriate for standard commercial applications.
• Manufacturer backing: Produced by Microchip Technology, offering supply-chain and documentation continuity for designers.

Why Choose A3PE3000L-1FG896?

The A3PE3000L-1FG896 combines a large logic fabric with substantial I/O and on-chip RAM in an industry-standard BGA package, offering a compact solution for commercial programmable-logic designs. Its voltage range and commercial temperature rating align with typical board-level systems and embedded applications.

This device is well suited for design teams seeking to consolidate multiple functions into a single FPGA, simplify board routing with high I/O counts, and retain flexibility through field-programmable logic backed by Microchip Technology’s product family and documentation.

Request a quote or submit an inquiry to receive pricing and availability information for the A3PE3000L-1FG896 and discuss suitability for your design requirements.