A3PE3000L-1FG484M

The A3PE3000L-1FG484M is a ProASIC3L Field Programmable Gate Array (FPGA) from Microchip Technology designed for military-grade, high-reliability applications. It provides a large logic fabric with integrated on-chip memory and a high I/O count in a compact 484-ball BGA package.

With MIL-STD-883 qualification, an extended operating temperature range, and a tight supply-voltage window, this device is targeted at designs that require robust performance, stringent qualification, and dense logic integration.

Key Features

• Logic Core 75,264 logic elements delivering approximately 3,000,000 gates for complex logic and control implementations.
• Embedded Memory Approximately 0.52 Mbits of on-chip RAM to support buffering, state machines, and intermediate data storage without external memory.
• I/O Capacity 341 user I/O pins to accommodate high-pin-count interfaces and multi-channel connectivity requirements.
• Package & Mounting 484-BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for dense board-level integration.
• Power Narrow operating supply range of 1.425 V to 1.575 V to meet defined system power requirements.
• Temperature Range Qualified for operation from −55 °C to 125 °C to support extended-temperature deployments.
• Qualification & Reliability Military grade with MIL-STD-883 qualification for use in applications requiring established military-level test standards.
• Environmental Compliance RoHS compliant for conformance with environmental material regulations.

Typical Applications

• Military and Defense Systems Suited for MIL-STD-883 qualified designs that require extended temperature operation and high reliability.
• High‑Density Logic Integration Ideal where substantial gate count and large logic element capacity are needed to consolidate multiple functions on a single device.
• Multi‑I/O Embedded Systems High I/O count supports complex interface requirements and dense peripheral connectivity on rugged embedded platforms.

Unique Advantages

• High Logic Density: 75,264 logic elements and roughly 3,000,000 gates enable consolidation of complex logic into a single FPGA, reducing overall system component count.
• Integrated On‑Chip Memory: Approximately 0.52 Mbits of embedded RAM provides local storage for buffering and state retention without immediate need for external memory.
• Robust Qualification: MIL-STD-883 qualification and military grade designation support deployment in systems with strict reliability and test requirements.
• Extended Temperature Capability: Rated from −55 °C to 125 °C for applications exposed to wide or harsh temperature environments.
• High I/O Count in Compact Package: 341 I/O in a 484-BGA (23×23) package delivers significant connectivity while maintaining a compact board footprint.
• Regulatory Compliance: RoHS compliance eases integration into designs that require adherence to environmental material standards.

Why Choose A3PE3000L-1FG484M?

The A3PE3000L-1FG484M combines substantial logic capacity, on-chip memory, and a high I/O complement within a military-qualified package, making it a strong fit for engineers building high-reliability, high-function-density embedded systems. Its narrow supply-voltage window and extended operating temperature range align with designs that demand predictable power behavior and environmental robustness.

This device is suitable for projects where long-term reliability and qualification matter, enabling consolidation of logic functions, streamlined board designs, and consistent behavior across demanding operating conditions.

Request a quote or submit an inquiry to evaluate A3PE3000L-1FG484M for your next qualified embedded design.