A3PE3000-1PQ208

The A3PE3000-1PQ208 is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) supplied in a 208-BFQFP surface-mount package. It provides a mid-range programmable fabric with 75,264 logic elements and approximately 0.52 Mbits of embedded memory, aimed at commercial embedded and communications applications that require reprogrammable logic with non-volatile configuration.

Key Features

• Core Logic 75,264 logic elements (CLBs) supporting up to 3,000,000 equivalent gates for implementing custom digital logic and glue logic.
• Embedded Memory Approximately 0.52 Mbits of on-chip RAM (516,096 bits) for FIFOs, buffering, and small data storage close to logic.
• I/O Count 147 user I/Os to connect to peripherals, sensors, and external devices with flexible pin availability in the 208-BFQFP footprint.
• Package & Mounting 208-BFQFP (supplier package 208-PQFP, 28 × 28) in a surface-mount form factor for compact board-level integration.
• Power Specified operating supply range of 1.425 V to 1.575 V for the device core.
• Operating Range & Grade Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• Regulatory Compliance RoHS-compliant construction to support modern manufacturing and environmental requirements.

Typical Applications

• Embedded Control Implement custom control algorithms and interface logic where moderate logic density and on-chip memory reduce external component count.
• Communications & Networking Provide protocol bridging, packet processing, or custom I/O adaptation in commercial networking equipment.
• Test & Measurement Build configurable data acquisition front-ends, timing control, and pre-processing functions using the device's logic and embedded RAM.
• Prototyping and Development Use as a reprogrammable platform for validating digital designs and iterating hardware implementations in commercial product development.

Unique Advantages

• High logic capacity: 75,264 logic elements enable substantial on-chip integration of glue logic, state machines, and custom datapaths, reducing the need for external ASICs or discrete logic.
• On-chip embedded memory: Approximately 0.52 Mbits of RAM supports buffering and small local storage, simplifying board-level memory requirements.
• Ample I/O count: 147 user I/Os give design flexibility for connecting multiple peripherals and interfaces from a single package.
• Compact surface-mount package: The 208-BFQFP (28 × 28) footprint balances pin count and board area for dense commercial designs.
• Commercial temperature grade: Specified 0 °C to 85 °C operation aligns with standard commercial electronics deployment.
• RoHS compliant: Built to meet RoHS requirements for environmentally conscious manufacturing.

Why Choose A3PE3000-1PQ208?

The A3PE3000-1PQ208 positions itself as a capable, flash-based FPGA option for commercial embedded and communications designs that need substantial logic resources, embedded RAM, and a high I/O count in a compact surface-mount package. Its combination of 75,264 logic elements, approximately 0.52 Mbits of on-chip memory, and 147 I/Os makes it suitable for applications that benefit from integrating multiple digital functions onto a single programmable device.

For teams developing commercial products that require reprogrammable logic with non-volatile configuration and a clear product qualification window, this device offers a balanced mix of capacity, package density, and compliance to simplify design and reduce component count.

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