A3PE3000-1FGG484I

The A3PE3000-1FGG484I is a ProASIC3E field programmable gate array (FPGA) designed for industrial applications requiring significant programmable logic, embedded memory and high I/O capacity. Its architecture delivers a large number of logic elements, on-chip RAM and broad I/O count in a compact 484-BGA package.

This device is positioned for industrial system designs that need a combination of logic density, on-chip memory and robust operating conditions, backed by RoHS compliance and surface-mount packaging for modern assembly processes.

Key Features

• Logic Capacity 75,264 logic elements providing a foundation for implementing complex custom logic and state machines.
• Gate Equivalent Approximately 3,000,000 gates for large-scale digital integration within a single FPGA device.
• Embedded Memory Approximately 0.516 Mbits of embedded memory to support buffering, state storage and small data tables on-chip.
• High I/O Count 341 user I/O pins to interface with multiple peripherals, sensors and external devices without external expander logic.
• Package & Mounting 484-BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for space-efficient board integration.
• Power Operates from a supply range of 1.425 V to 1.575 V, enabling predictable power budgeting in system design.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet thermal requirements of industrial environments.
• RoHS Compliance RoHS-compliant construction for alignment with environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Implement custom control logic, state machines and high-density I/O handling for factory automation and process control systems that require industrial temperature operation.
• Communications Equipment — Provide programmable protocol handling and I/O interfacing where high gate count and significant I/O resources are needed.
• Embedded Systems — Serve as the programmable core for embedded platforms that need on-chip memory and extensive logic resources in a compact BGA package.

Unique Advantages

• High Logic Density: 75,264 logic elements and ~3,000,000 gates enable implementation of complex digital functions without external devices.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces reliance on external memory for buffering and small data tables.
• Extensive I/O: 341 I/O pins simplify board-level designs by accommodating multiple interfaces directly on the FPGA.
• Industrial Robustness: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact, Surface-Mount Package: 484-BGA (23×23) enables dense, surface-mount PCB layouts for space-constrained systems.
• Regulatory Compatibility: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose A3PE3000-1FGG484I?

The A3PE3000-1FGG484I balances substantial programmable logic capacity, embedded memory and a high I/O count within a surface-mount 484-BGA package rated for industrial temperature operation. These attributes make it suitable for designs that require dense logic integration, reliable operation across a wide temperature range and reduced external component count.

For engineering teams building industrial control, communications or embedded platforms, this device offers a compact, verifiable building block with clear electrical, thermal and packaging specifications to streamline system-level design and procurement.

Request a quote or contact sales to discuss availability, pricing and lead times for the A3PE3000-1FGG484I.