A3PE3000-1FG896I

The A3PE3000-1FG896I is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology designed for applications requiring high logic density and a large number of I/O connections. It provides 75,264 logic elements, approximately 0.516 Mbits of embedded memory, and a gate capacity of 3,000,000 gates in a 896-BGA package.

This surface-mount, industrial-grade FPGA operates across a supply voltage range of 1.425 V to 1.575 V and an extended operating temperature range of −40 °C to 100 °C, making it suitable for deployments that demand robust thermal and electrical operating margins.

Key Features

• Core Logic 75,264 logic elements and 3,000,000 gates provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM for buffering, FIFOs, and state storage within the FPGA fabric.
• I/O Density 620 I/O pins support high connectivity for parallel interfaces, sensor arrays, and multi-channel systems.
• Package and Mounting 896-BGA supplier device package (896-FBGA, 31 × 31 mm) in a surface-mount form factor for compact board integration.
• Power Operates from a core voltage supply range of 1.425 V to 1.575 V, enabling predictable power budgeting for system design.
• Thermal Range Industrial operating temperature from −40 °C to 100 °C to support deployment in demanding environments.
• Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control Use the FPGA’s logic capacity and extended temperature range for programmable control, signal processing, and interface consolidation in industrial systems.
• High-Density I/O Systems Leverage 620 I/O pins for multi-channel data acquisition, communication gateways, and complex peripheral interfacing.
• Embedded System Integration Integrate logic, memory, and I/O in a single device to reduce board-level component count and simplify system architecture.

Unique Advantages

• High Logic Capacity: 75,264 logic elements enable implementation of large and complex digital functions without external glue logic.
• Significant On-Chip Memory: Approximately 0.516 Mbits of embedded RAM supports buffering and state machines directly within the FPGA fabric.
• Extensive I/O Resources: 620 I/Os provide the flexibility to connect many peripherals, sensors, and interfaces without external multiplexing.
• Industrial Temperature Rating: Rated for −40 °C to 100 °C operation, offering suitability for harsh or temperature-variable deployments.
• Compact BGA Footprint: The 896-FBGA (31 × 31 mm) package balances high pin count with a compact board footprint for space-constrained designs.
• Regulatory Alignment: RoHS compliance helps streamline manufacturing and environmental requirements.

Why Choose A3PE3000-1FG896I?

The A3PE3000-1FG896I combines a large logic element count, substantial on-chip memory, and a very high I/O count in a single industrial-grade, surface-mount 896-BGA package. These attributes make it well suited for designers who need a dense, integrated programmable-logic solution with robust electrical and thermal operating ranges.

As a Microchip Technology product, this FPGA is positioned for designs that prioritize integration, scalability, and long-term availability in industrial environments. Its combination of logic density, memory, and I/O resources supports consolidation of multiple functions into a single programmable device, reducing system complexity and BOM count.

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