A3PE3000-1FG896

The A3PE3000-1FG896 is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology. It offers 3,000,000 gates and 75,264 logic elements in a high pin‑count 896‑FBGA (31×31) package, delivering on‑chip resources for complex digital designs.

With 620 user I/O pins, approximately 0.52 Mbits of embedded RAM and a defined core voltage range of 1.425 V to 1.575 V, this device is targeted at designs that require substantial logic capacity, dense I/O connectivity and embedded memory in a commercial temperature grade.

Key Features

• Core Logic  3,000,000 gates and 75,264 logic elements provide extensive programmable logic capacity for implementing complex digital functions.
• Embedded Memory  516,096 bits of on‑chip RAM (approximately 0.52 Mbits) for localized data storage and buffering within designs.
• I/O Density  620 user I/O pins support high connectivity and integration of multiple signals and interfaces directly to the FPGA.
• Power Supply  Specified core voltage range of 1.425 V to 1.575 V to match system power rails and regulator design.
• Package and Mounting  896‑FBGA (31×31) package in a surface mount form factor for high‑density board layouts.
• Thermal and Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Custom digital logic  Implement application‑specific state machines, data paths and protocol handlers using the device's large logic element capacity.
• High‑density I/O interfacing  Leverage 620 I/O pins to aggregate and route large numbers of signals between subsystems on a single FPGA.
• On‑chip buffering and data staging  Use the approximately 0.52 Mbits of embedded RAM for local buffering, FIFOs or temporary data storage in streaming or packetized designs.

Unique Advantages

• Substantial logic resources: 3,000,000 gates and 75,264 logic elements enable implementation of sizable digital systems without external glue logic.
• High I/O capacity: 620 I/O pins reduce the need for additional interface components and simplify board routing for pin‑dense designs.
• Integrated memory: Over half a megabit of on‑chip RAM supports local data handling and reduces dependence on external memory for many tasks.
• Compact, surface‑mount package: 896‑FBGA (31×31) provides a high pin count in a package suited to modern PCB assembly and space‑constrained layouts.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to match typical commercial electronics environments.
• RoHS compliant: Aligns with standard environmental and manufacturing requirements.

Why Choose A3PE3000-1FG896?

The A3PE3000-1FG896 combines a large logic fabric, substantial embedded RAM and very high I/O density in a single 896‑FBGA surface‑mount package, making it appropriate for complex digital implementations where on‑chip resources and pin count are primary considerations. Its defined core voltage range and commercial temperature rating allow straightforward integration into standard electronic systems.

As a member of the ProASIC3E family from Microchip Technology, this device is positioned for designers who need a programmable, high‑capacity logic device with integrated memory and extensive I/O in a compact package.

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