A3PE3000-1FG324I

The A3PE3000-1FG324I is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology, offered in a 324-BGA package. It provides a high logic density with 75,264 logic elements and approximately 0.516 Mbits of embedded memory, making it suitable for industrial applications that require robust on-chip logic and I/O capability.

Designed for surface-mount assembly and specified for an industrial operating range, this device balances integration and I/O capacity to support complex control, processing, and interface functions in industrial environments.

Key Features

• Core Logic  75,264 logic elements delivering up to 3,000,000 gates for implementing complex digital functions and custom logic pipelines.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O Capacity  221 user I/O pins to support multiple interfaces, sensor arrays, and external device connectivity in I/O-intensive designs.
• Power Supply  Specified core voltage range of 1.425 V to 1.575 V to match platform power-rail requirements.
• Package & Mounting  324-BGA package (supplier package: 324-FBGA, 19×19) in a surface-mount form factor for compact, high-density board integration.
• Operating Range  Industrial temperature rating from -40 °C to 100 °C for deployment in harsh or variable-temperature environments.
• Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Industrial automation  Use the device’s logic density and industrial temperature range to implement control logic, PLC peripherals, or interface bridges on factory equipment.
• Embedded control systems  Leverage the combination of abundant logic elements and on-chip RAM for real-time control, custom processing blocks, and state machines.
• I/O-heavy designs  Deploy the 221 I/O pins to consolidate multiple sensors, actuators, or communication endpoints onto a single FPGA-based controller.

Unique Advantages

• High integration density: 75,264 logic elements and 3,000,000 gates allow consolidation of multiple functions into one device, reducing board-level component count.
• Compact board footprint: 324-BGA (324-FBGA, 19×19) package enables high-pin-count capability in a space-efficient surface-mount package.
• Robust industrial operation: Rated from -40 °C to 100 °C to withstand temperature extremes commonly encountered in industrial deployments.
• Generous I/O availability: 221 I/O pins provide flexibility for parallel interfaces, mixed-signal front ends, and extensive peripheral connections.
• Regulatory readiness: RoHS compliance supports environmentally conscious product builds.

Why Choose A3PE3000-1FG324I?

The A3PE3000-1FG324I positions itself as a high-density, industrial-grade FPGA option from Microchip Technology, combining substantial logic capacity, embedded memory, and a large I/O complement in a compact 324-BGA package. Its industrial temperature rating and surface-mount packaging make it practical for robust embedded systems and control applications where board space and environmental resilience matter.

This device suits engineering teams designing consolidated control, interface, or processing solutions that benefit from on-chip integration and significant I/O headroom. Its specifications support long-term deployment in industrial environments while helping reduce discrete component count and simplify system design.

Request a quote or submit a pricing inquiry to evaluate the A3PE3000-1FG324I for your next industrial FPGA design.