A3PE3000-1FG324

The A3PE3000-1FG324 is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high logic capacity and a compact BGA footprint for commercial programmable-logic designs.

Key on-chip resources include 3,000,000 gates, 75,264 logic elements, approximately 0.516 Mbits of embedded memory and 221 I/O pins. The device is supplied in a 324-FBGA (19×19) surface-mount package, operates from 1.425 V to 1.575 V and is rated for commercial temperatures (0 °C to 85 °C). RoHS compliance is provided.

Key Features

• Core Density  3,000,000 gates and 75,264 logic elements provide substantial programmable logic capacity for complex designs.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for buffering, state storage and small data structures.
• I/O Resources  221 I/O pins enable broad peripheral and bus interfacing on a single device.
• Power  Core voltage supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Package & Mounting  324-FBGA (19×19) surface-mount package delivers high density and a compact PCB footprint.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard consumer and business environments.
• Environmental Compliance  RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Commercial Embedded Systems — Implement configurable digital logic and integration tasks in commercial products where programmable logic is required.
• Digital Control and Glue Logic — Consolidate discrete control, interface translation, and glue logic using on-chip resources.
• High-Density I/O Integration — Use the 221 available I/O pins in compact BGA form factors to simplify board-level routing and connectivity.

Unique Advantages

• High Logic Capacity: 3,000,000 gates and 75,264 logic elements allow integration of substantial digital functionality in a single FPGA.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces the need for external memory for many buffering and state storage tasks.
• Compact, High-Density Package: 324-FBGA (19×19) surface-mount package enables dense board layouts while providing a large number of I/O.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation supports standard commercial deployments and product lifecycles.
• Regulatory Readiness: RoHS compliance supports lead-free assembly and regulatory requirements for many markets.

Why Choose A3PE3000-1FG324?

The A3PE3000-1FG324 positions itself as a high-capacity, commercially rated FPGA for designs that require extensive programmable logic, embedded RAM and substantial I/O in a compact BGA footprint. Its combination of 3,000,000 gates, 75,264 logic elements and approximately 0.516 Mbits of on-chip memory makes it suitable for consolidating complex digital functions onto a single device.

This device is well suited to commercial product developers and system designers who need scalable programmable logic with a compact form factor, clearly defined voltage requirements (1.425 V–1.575 V) and standard commercial temperature range, backed by Microchip Technology manufacturing and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability information for the A3PE3000-1FG324 and to discuss how it can fit into your next commercial FPGA design.