A3PE3000-1FGG324

The A3PE3000-1FGG324 is a ProASIC3E family Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a balance of logic capacity, I/O density and on-chip memory for commercial electronic designs.

With 3,000,000 gates, 75,264 logic elements and 221 I/Os in a 324-BGA package, this device targets designs that require significant programmable logic and moderate embedded memory while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity 75,264 logic elements providing the programmable resources needed for complex custom logic implementations.
• Gate Count 3,000,000 gates to support large-scale logic functions and design partitioning.
• Embedded Memory Approximately 0.516 Mbits of on-chip RAM for buffering, FIFOs and small data storage needs.
• I/O Density 221 user I/Os enabling connection to multiple peripherals, interfaces and external devices.
• Power Supply Operates from a supply range of 1.425 V to 1.575 V to match platform power rails and design constraints.
• Package and Mounting 324-BGA (supplier package 324-FBGA, 19×19) in a surface-mount footprint for compact board-level integration.
• Operating Range Commercial grade operation from 0 °C to 85 °C for standard embedded applications.
• RoHS Compliant Manufactured to meet RoHS environmental requirements.

Typical Applications

• Embedded systems and control Implement custom control logic using the device’s 75,264 logic elements and 221 I/Os to interface with sensors and actuators.
• High-density I/O designs Leverage 221 I/Os in compact board designs where multiple external connections are required.
• Data buffering and processing Use approximately 0.516 Mbits of embedded RAM for temporary storage, FIFOs and small on-chip data structures.

Unique Advantages

• Significant logic resources: 75,264 logic elements and 3,000,000 gates support large, partitioned designs without immediate migration to larger devices.
• High I/O count: 221 I/Os simplify system integration by reducing external interface components and routing complexity.
• Compact packaging: 324-BGA (324-FBGA, 19×19) enables dense board layouts while maintaining robust connectivity.
• Targeted power range: A defined supply range of 1.425 V to 1.575 V helps align the device with common FPGA power architectures.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation for typical commercial electronic applications.
• Regulatory compliance: RoHS compliant to support environmentally constrained designs.

Why Choose A3PE3000-1FGG324?

The A3PE3000-1FGG324 offers a balanced combination of logic density, I/O capacity and on-chip memory in a compact 324-BGA surface-mount package. Its specifications make it suitable for commercial embedded designs that require substantial programmable logic alongside a high number of external interfaces.

Engineers selecting this FPGA will benefit from a clear set of device parameters—3,000,000 gates, 75,264 logic elements, approximately 0.516 Mbits of RAM, 221 I/Os, defined supply and temperature ranges—allowing straightforward integration into designs where those characteristics match system requirements.

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