A3PE3000-1FGG896
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 620 516096 896-BGA |
|---|---|
| Quantity | 557 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 620 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 75264 | Number of Logic Elements/Cells | 75264 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of A3PE3000-1FGG896 – ProASIC3E Field Programmable Gate Array (FPGA) IC 620 516096 896-BGA
The A3PE3000-1FGG896 is a ProASIC3E FPGA from Microchip Technology designed for applications requiring dense logic and extensive I/O. The device includes 75,264 logic elements, approximately 0.516 Mbits of embedded memory (516,096 bits) and approximately 3,000,000 gates, delivered in an 896-ball BGA package (896-FBGA, 31×31) for surface-mount assembly.
Electrical and environmental characteristics include a supply voltage range of 1.425 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Core Logic Approximately 75,264 logic elements to implement complex digital functions and control logic.
- Embedded Memory Approximately 0.516 Mbits of total on-chip RAM (516,096 bits) for data buffering and storage.
- I/O Capacity 620 I/O pins to support extensive peripheral and system interfacing.
- Gate Density Approximately 3,000,000 gates providing substantial logic integration capability.
- Power Nominal supply range of 1.425 V to 1.575 V for core operation.
- Package & Mounting 896-BGA (supplier device package: 896-FBGA, 31×31) in a surface-mount form factor for high-pin-count board designs.
- Temperature & Grade Commercial grade device with specified operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic integration: Large number of logic elements and gate count enable consolidation of multiple functions into a single device, reducing component count.
- On-chip memory availability: Approximately 0.516 Mbits of embedded RAM provides local storage for state, buffering, and small data structures without external memory.
- Extensive I/O support: 620 I/O pins allow broad interface options and connectivity to peripherals or system buses.
- Compact, high‑pin package: 896-FBGA (31×31) supports high-density board layouts while maintaining a surface-mount assembly process.
- Defined electrical and thermal envelope: Clear supply voltage range (1.425 V–1.575 V) and commercial temperature rating (0 °C–85 °C) simplify system-level design margins.
- Regulatory readiness: RoHS compliance supports use in applications requiring regulatory environmental conformance.
Why Choose A3PE3000-1FGG896?
The A3PE3000-1FGG896 positions itself as a solution for designs that require a combination of significant logic capacity, embedded memory, and a large number of I/Os in a compact surface-mount BGA package. Its defined supply voltage range and commercial temperature rating make it suitable for a broad set of commercial electronics projects.
For engineers and procurement teams seeking a RoHS-compliant FPGA with clear, verifiable specifications for logic density, memory, I/O count, package, and operating conditions, the A3PE3000-1FGG896 offers a specification-driven choice from Microchip Technology.
To request a quote or submit an inquiry for pricing and availability, please submit a request through your procurement channel or quote submission process.

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