A3PE3000-1FGG896

IC FPGA 620 I/O 896FBGA
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 620 516096 896-BGA

Quantity 557 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BGANumber of I/O620Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of A3PE3000-1FGG896 – ProASIC3E Field Programmable Gate Array (FPGA) IC 620 516096 896-BGA

The A3PE3000-1FGG896 is a ProASIC3E FPGA from Microchip Technology designed for applications requiring dense logic and extensive I/O. The device includes 75,264 logic elements, approximately 0.516 Mbits of embedded memory (516,096 bits) and approximately 3,000,000 gates, delivered in an 896-ball BGA package (896-FBGA, 31×31) for surface-mount assembly.

Electrical and environmental characteristics include a supply voltage range of 1.425 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Core Logic  Approximately 75,264 logic elements to implement complex digital functions and control logic.
  • Embedded Memory  Approximately 0.516 Mbits of total on-chip RAM (516,096 bits) for data buffering and storage.
  • I/O Capacity  620 I/O pins to support extensive peripheral and system interfacing.
  • Gate Density  Approximately 3,000,000 gates providing substantial logic integration capability.
  • Power  Nominal supply range of 1.425 V to 1.575 V for core operation.
  • Package & Mounting  896-BGA (supplier device package: 896-FBGA, 31×31) in a surface-mount form factor for high-pin-count board designs.
  • Temperature & Grade  Commercial grade device with specified operation from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic integration: Large number of logic elements and gate count enable consolidation of multiple functions into a single device, reducing component count.
  • On-chip memory availability: Approximately 0.516 Mbits of embedded RAM provides local storage for state, buffering, and small data structures without external memory.
  • Extensive I/O support: 620 I/O pins allow broad interface options and connectivity to peripherals or system buses.
  • Compact, high‑pin package: 896-FBGA (31×31) supports high-density board layouts while maintaining a surface-mount assembly process.
  • Defined electrical and thermal envelope: Clear supply voltage range (1.425 V–1.575 V) and commercial temperature rating (0 °C–85 °C) simplify system-level design margins.
  • Regulatory readiness: RoHS compliance supports use in applications requiring regulatory environmental conformance.

Why Choose A3PE3000-1FGG896?

The A3PE3000-1FGG896 positions itself as a solution for designs that require a combination of significant logic capacity, embedded memory, and a large number of I/Os in a compact surface-mount BGA package. Its defined supply voltage range and commercial temperature rating make it suitable for a broad set of commercial electronics projects.

For engineers and procurement teams seeking a RoHS-compliant FPGA with clear, verifiable specifications for logic density, memory, I/O count, package, and operating conditions, the A3PE3000-1FGG896 offers a specification-driven choice from Microchip Technology.

To request a quote or submit an inquiry for pricing and availability, please submit a request through your procurement channel or quote submission process.

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