A3PE1500-FGG676

The A3PE1500-FGG676 is a ProASIC3E field programmable gate array (FPGA) IC providing on-chip programmable logic and embedded RAM. It combines a large logic resource set and significant I/O in a compact 676-ball BGA package for commercial applications that require programmable digital integration.

This device delivers 38,400 logic elements, approximately 276 kb of embedded memory, and 444 I/O pins while operating from a 1.425 V to 1.575 V supply and a 0 °C to 85 °C temperature range.

Key Features

• Core Logic  38,400 logic elements (logic cells) and approximately 1,500,000 gates provide a substantial resource pool for implementing custom digital functions.
• Embedded Memory  Total on-chip RAM of 276,480 bits (approximately 0.276 Mbits) for local buffering, state storage, and small LUT-based memory structures.
• I/O Capacity  444 user I/O pins to support dense external interfacing and multiple parallel connections.
• Package  676-ball BGA (676-FBGA, 27 × 27 mm) surface-mount package for a compact PCB footprint and high pin count routing.
• Power  Single-core supply range of 1.425 V to 1.575 V for the programmable fabric.
• Operating Conditions  Commercial temperature grade, specified for 0 °C to 85 °C operation.
• Assembly  Surface-mount mounting type suitable for standard PCB assembly processes.
• Environmental  RoHS compliant.

Typical Applications

• Programmable logic integration  Use the device's 38,400 logic elements and embedded RAM to implement custom digital functions and glue logic between subsystems.
• High-density I/O interfacing  Leverage 444 I/O pins for parallel interfaces, bus bridging, or multi-channel sensor and actuator connections.
• Compact system designs  The 676-FBGA (27 × 27 mm) package enables high pin count in a compact board footprint for space-constrained applications.

Unique Advantages

• High logic capacity: 38,400 logic elements and approximately 1.5 million gates enable complex state machines and wide datapath implementations.
• Significant on-chip memory: Approximately 276 kb of embedded RAM reduces dependence on external memory for small buffers and LUT-based storage.
• Extensive I/O: 444 I/O pins provide flexibility for multiple parallel interfaces, sensor arrays, or multi-channel designs.
• Compact BGA packaging: 676-FBGA (27 × 27) offers a dense pinout in a relatively small footprint to simplify board layout for high-pin-count designs.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose A3PE1500-FGG676?

The A3PE1500-FGG676 positions itself as a high-capacity ProASIC3E FPGA option for commercial designs that require a large number of logic elements, substantial on-chip RAM, and extensive I/O in a compact BGA package. Its specified supply range and temperature rating make it suitable for a broad set of standard embedded applications.

Choose this device when your design needs a balance of logic density, embedded memory, and high I/O count while maintaining a compact footprint and RoHS compliance.

If you need pricing, availability, or a quote for the A3PE1500-FGG676, request a quote or submit your procurement inquiry today.