A3PE1500-FG676

The A3PE1500-FG676 is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 1,500,000 gates with 38,400 logic elements and approximately 0.276 Mbits (276,480 bits) of embedded RAM in a high-density 676-ball BGA package.

Configured for surface-mount board integration, the device offers 444 I/O pins, operates from a 1.425 V to 1.575 V supply range, and is specified for commercial operation from 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Programmable Logic Capacity 38,400 logic elements providing a total of 1,500,000 gates for implementing sizable digital designs.
• Embedded Memory Approximately 0.276 Mbits (276,480 bits) of on-chip RAM to support buffering, state storage, and local data structures.
• I/O Resources 444 user I/O pins to support wide bus interfaces and multiple peripheral connections on a single device.
• Package and Mounting 676-BGA package (supplier device package: 676-FBGA, 27×27) intended for surface-mount PCB assembly.
• Power Requirements Narrow operating supply range of 1.425 V to 1.575 V for core power planning.
• Operating Range and Grade Commercial grade device specified for operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for lead-free assembly requirements.

Typical Applications

• Programmable Logic Integration — Implement custom digital logic, parallel processing blocks, and control functions where up to 1,500,000 gates are required.
• I/O-Intensive Systems — Board-level systems that require large numbers of external interfaces can leverage the device's 444 I/O pins.
• Embedded Memory-Dependent Designs — Applications that need on-chip RAM for buffering or local data storage can use the approximately 0.276 Mbits of embedded memory.
• Surface-Mount PCB Integration — High-density BGA packaging suits compact, surface-mount board designs in commercial electronics.

Unique Advantages

• High Logic Density: 1,500,000 gates and 38,400 logic elements enable complex digital implementations without external programmable logic.
• Substantial I/O Count: 444 I/O pins reduce the need for external multiplexing and simplify interconnection to peripherals and memory devices.
• On-chip RAM: Approximately 0.276 Mbits of embedded memory supports local buffering and state retention, reducing external memory dependence.
• Compact BGA Footprint: 676-ball FBGA (27×27) provides a balance of I/O density and board-area efficiency for compact designs.
• Pared Power Specification: A defined core voltage window (1.425 V–1.575 V) simplifies power-supply design and validation.
• RoHS Compliance: Facilitates inclusion in lead-free product assemblies and supports regulatory requirements.

Why Choose A3PE1500-FG676?

The A3PE1500-FG676 positions itself as a high-density, I/O-rich FPGA option for commercial electronic designs that require substantial programmable logic, embedded RAM, and extensive board-level interfacing. Its combination of 1,500,000 gates, 38,400 logic elements, and 444 I/O pins supports complex integration while the 676-BGA package keeps PCB footprint efficient.

Engineers specifying Microchip Technology’s ProASIC3E family can rely on this part for scalable logic capacity in surface-mount applications within the commercial temperature range, with clear electrical and environmental attributes to support procurement and system-level planning.

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