A3PE1500-2PQ208

The A3PE1500-2PQ208 is a ProASIC3E series FPGA from Microchip Technology designed for commercial embedded applications requiring substantial on-chip logic and memory in a compact surface-mount package. It provides 1,500,000 gates, 38,400 logic elements and approximately 0.276 Mbits of embedded memory, making it suitable for complex glue-logic, protocol bridging and control tasks.

With 147 user I/O pins, a 208-BFQFP (208-PQFP 28×28) package, and a nominal core voltage window of 1.425 V to 1.575 V, this device balances integration density with predictable power and thermal characteristics across a 0 °C to 85 °C commercial operating range.

Key Features

• Core Logic  Provides 1,500,000 gates and 38,400 logic elements to implement large-scale combinational and sequential logic functions on a single device.
• Embedded Memory  Includes approximately 0.276 Mbits of total on-chip RAM for buffering, FIFOs and local data storage close to logic.
• I/O Density  147 user I/O pins support versatile interfacing options for parallel buses, control signals and I/O expansion in a single package.
• Power  Specified core supply range of 1.425 V to 1.575 V enables stable operation within tight voltage tolerances for consistent performance.
• Package & Mounting  208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for compact PCB layouts and automated assembly.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant for environmental compliance in commercial products.

Typical Applications

• Commercial Embedded Systems  On-board programmable logic for control, data handling and interface consolidation in consumer and business electronics.
• Protocol Bridging & Interface Conversion  Use the device’s logic density and I/O count to implement protocol translation and signal routing between subsystems.
• Peripheral and I/O Management  Centralize glue logic, bus arbitration and custom I/O functions to reduce external component count and simplify BOM.

Unique Advantages

• High Logic Capacity: 1.5M gates and 38,400 logic elements let you consolidate complex functions that would otherwise require multiple discrete ICs.
• Embedded Memory for Local Data: Approximately 0.276 Mbits of on-chip RAM supports buffering and small data structures without external memory.
• Substantial I/O Count: 147 user I/O pins provide flexible connectivity for diverse peripheral and bus requirements in a single-package solution.
• Compact Surface-Mount Package: 208-BFQFP (208-PQFP 28×28) supports compact PCB layouts and industry-standard assembly processes.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for deployment in commercial products with environmental considerations.

Why Choose A3PE1500-2PQ208?

The A3PE1500-2PQ208 delivers a balanced combination of high logic density, embedded memory and abundant I/O in a compact surface-mount 208-BFQFP package, making it well suited for commercial embedded designs that require on-board programmable logic and interface consolidation. Its defined core voltage range and commercial temperature rating provide predictable integration characteristics for production designs.

Designers looking to reduce board-level complexity, lower external component counts and centralize custom logic functions will find this ProASIC3E device appropriate for medium- to high-complexity applications where RoHS compliance and a compact package are important considerations.

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