A3PE1500-1FG676

The A3PE1500-1FG676 is a ProASIC3E family FPGA manufactured by Microchip Technology, offered in a 676-ball BGA (27×27) package for surface-mount applications. It provides a commercial-grade programmable logic solution with a focus on high logic density, abundant I/O and on-chip RAM for a range of digital design requirements.

Key Features

• Logic Capacity — 38,400 logic elements and approximately 1,500,000 gates enable implementation of complex digital logic functions and medium-to-high density designs.
• Embedded Memory — Approximately 0.276 Mbits (276,480 bits) of on-chip RAM to support buffer, FIFO and small data-storage needs within the FPGA fabric.
• I/O Count — 444 user I/O pins to support extensive peripheral interfacing and parallel connectivity in compact system designs.
• Package & Mounting — 676-BGA (676-FBGA, 27×27) package in a surface-mount form factor for space-efficient board layouts.
• Power — Core supply range of 1.425 V to 1.575 V to match platform power domains and regulator selections.
• Operating Range — Commercial temperature grade rated from 0 °C to 85 °C for standard commercial-environment deployments.
• Environmental Compliance — RoHS compliant to support material-restricted manufacturing requirements.

Typical Applications

• Commercial Embedded Systems — Implement custom digital logic and control functions in board-level products requiring commercial-grade components.
• High-Density Digital Logic — Use the device’s 38,400 logic elements to realize complex state machines, data-paths and protocol processing in a single FPGA.
• I/O-Intensive Designs — Leverage 444 I/O pins to consolidate interfaces and peripheral connections on compact PCBs.
• On-Board Memory Support — Utilize the on-chip RAM for buffering, small FIFOs and temporary data storage within FPGA-driven subsystems.

Unique Advantages

• High Logic Integration: 38,400 logic elements and 1.5M gates reduce the need for multiple discrete logic devices and simplify board-level designs.
• Large I/O Count: 444 I/O pins provide flexibility to connect numerous peripherals and interfaces without external multiplexing.
• Compact BGA Packaging: 676-FBGA (27×27) enables a high-pin-count footprint in a space-efficient surface-mount package.
• On-Chip RAM: Approximately 0.276 Mbits of embedded memory supports local data buffering and temporary storage inside the FPGA fabric.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• RoHS Compliant: Aligns with material restriction requirements for modern electronics manufacturing.

Why Choose A3PE1500-1FG676?

The A3PE1500-1FG676 delivers a balanced combination of logic density, on-chip memory and high I/O count in a compact 676-BGA package, tailored for commercial embedded and digital logic applications. Its defined core voltage range and commercial temperature rating make it suitable for designers seeking a programmable, integrated solution that consolidates multiple functions onto a single device.

This part is appropriate for teams developing medium-to-high complexity FPGA designs that require substantial I/O, local RAM and a dense logic fabric, while maintaining compliance with RoHS material requirements.

Request a quote or submit an inquiry to check pricing and availability for the A3PE1500-1FG676. Our team can provide lead-time information and support for your procurement and design planning.