A3PE1500-1FG676I

The A3PE1500-1FG676I is a ProASIC3E family Field Programmable Gate Array from Microchip Technology. It provides mid-density programmable logic with a high I/O count and on-chip embedded memory for custom digital designs.

Built for industrial environments, this surface-mount FPGA offers a balance of logic capacity, I/O resources and a compact 676-ball BGA package suitable for space-conscious, I/O-heavy applications.

Key Features

• Logic Capacity — Approximately 38,400 logic elements delivering a total of 1,500,000 gates for mid-density programmable logic implementations.
• Embedded Memory — Approximately 0.276 Mbits of on-chip RAM (276,480 total RAM bits) to support buffering, state storage and small data structures.
• I/O Resources — 444 available I/O pins to support wide parallel interfaces and dense external connectivity.
• Power — Core supply range of 1.425 V to 1.575 V to match target power architecture requirements.
• Package and Mounting — 676-BGA package (supplier device package: 676-FBGA, 27×27 mm) in a surface-mount form factor for compact board integration.
• Industrial Grade Temperature — Rated for operation from -40°C to 100°C for deployment in industrial temperature environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• I/O-Intensive Systems — Suitable for designs requiring a large number of external signals, thanks to 444 I/O pins.
• Mid-Density Programmable Logic — Use where approximately 38,400 logic elements and 1,500,000 gates meet the logic resource needs of custom digital functions.
• Embedded Memory-Dependent Functions — On-chip RAM (276,480 bits) supports buffering and temporary data storage within the FPGA fabric.
• Industrial Equipment — Rated for -40°C to 100°C operation, making it appropriate for industrial temperature environments.
• Compact, High-Pin-Count Designs — The 676-FBGA (27×27) package enables high pin count in a compact footprint for space-constrained boards.

Unique Advantages

• High I/O Density: 444 I/O pins provide flexible connectivity for parallel interfaces and multi-signal systems, reducing the need for external multiplexing.
• Balanced Logic and Memory: Approximately 38,400 logic elements combined with 276,480 bits of on-chip RAM support a wide range of mid-density designs without external memory for small buffers.
• Industrial Temperature Rating: -40°C to 100°C operating range supports deployment in industrial environments where extended temperature tolerance is required.
• Compact BGA Packaging: 676-FBGA (27×27) enables a high-pin-count solution in a compact surface-mount package to save PCB area.
• Controlled Power Envelope: Specified core supply range (1.425 V–1.575 V) allows straightforward integration into regulated power systems.
• RoHS Compliant: Meets environmental compliance requirements for lead-free manufacturing processes.

Why Choose A3PE1500-1FG676I?

The A3PE1500-1FG676I positions itself as a mid-density, industrial-grade FPGA option within the ProASIC3E family, combining substantial logic resources, meaningful embedded memory, and a very high I/O count in a compact 676-BGA package. Its electrical and thermal specifications make it suitable for designs that require reliable operation across an extended temperature range.

Designers and procurement teams seeking a programmable logic device with strong I/O capability, a sizeable logic element count, and industrial temperature tolerance will find this device well-suited for a range of embedded and system-level applications.

Request a quote today to begin evaluating the A3PE1500-1FG676I for your next design project.