A3P600L-FGG144I

The A3P600L-FGG144I is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, offering a mid-range programmable logic resource set for industrial applications. It combines 13,824 logic elements and approximately 0.11 Mbits of embedded memory in a compact 144-LBGA package.

This device is intended for designs that require a balance of logic capacity, on-chip RAM, and a broad operating temperature range (−40 °C to 100 °C), with low-voltage core operation between 1.14 V and 1.575 V.

Key Features

• Core Logic 13,824 logic elements delivering a programmable fabric suitable for mid-density logic implementations; equivalent to 600,000 gates.
• Embedded Memory 110,592 total RAM bits (approximately 0.11 Mbits) for on-chip buffering, state storage, and small data structures.
• I/O Resources 97 user I/Os for interfacing with external peripherals, sensors, and bus structures.
• Low-Voltage Operation Core supply range from 1.14 V to 1.575 V to match low-voltage system designs.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to support deployment in challenging environments.
• Package & Mounting 144-LBGA (supplier package: 144-FPBGA 13×13) in a surface-mount form factor for compact board-level integration.
• Regulatory RoHS compliant to meet modern environmental compliance requirements.

Typical Applications

• Industrial Control Use for programmable logic in factory automation, motion control, and PLC subsystems where industrial temperature operation and robust I/O counts are required.
• Embedded Systems Integration as a mid-density programmable fabric for custom logic, protocol bridging, or control tasks in embedded products.
• Communications Equipment Implementation of interface processing, protocol adaptation, and buffering tasks that leverage the device’s I/O complement and on-chip RAM.
• Test & Measurement Customizable logic for signal conditioning, timing control, and data aggregation in instrumentation applications.

Unique Advantages

• Balanced Logic Density: 13,824 logic elements (≈600,000 gates) offer a practical trade-off between capacity and cost for mid-range designs.
• On-Chip Memory: Approximately 0.11 Mbits of embedded RAM reduces the need for external memory for many buffering and state-storage tasks.
• Robust Thermal Range: −40 °C to 100 °C rating supports deployment in industrial and other temperature-challenging environments.
• Low-Voltage Core: 1.14 V to 1.575 V supply supports integration into low-voltage power rails.
• Compact Surface-Mount Package: 144-LBGA (13×13 FPBGA) enables space-efficient board designs while providing plentiful I/O.
• Compliance-Ready: RoHS compliance aligns with environmental and manufacturing requirements.

Why Choose A3P600L-FGG144I?

The A3P600L-FGG144I is positioned for engineers who need a mid-density FPGA with a combination of logic resources, embedded memory, and industrial operating range. Its 13,824 logic elements, 110,592 bits of RAM, and 97 I/Os provide the core building blocks for control, interface, and data-processing functions in compact, temperature-demanding designs.

Backed by Microchip Technology and supplied in a space-saving 144-LBGA surface-mount package, this device delivers a practical, standards-compliant option for industrial and embedded applications where reliable operation and on-chip integration are priorities.

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