A3P600L-FG484I

The A3P600L-FG484I is a ProASIC3L Field Programmable Gate Array (FPGA) from Microchip Technology offering 13,824 logic elements and approximately 600,000 gates in a compact 484-ball FBGA package. It provides on-chip embedded memory and a high I/O count in an industrial-grade, surface-mount device.

Designed for industrial and embedded applications, this device delivers a balance of logic capacity, embedded RAM, and 235 I/O pins, with supply and temperature ranges suited to demanding environments.

Key Features

• Core Logic: 13,824 logic elements providing approximately 600,000 gates for implementing custom digital functions.
• Embedded Memory: Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for data buffering, state storage, and small lookup tables.
• I/O Resources: 235 programmable I/O pins to support multiple parallel interfaces and peripheral connections.
• Voltage Supply: Operates from 1.14 V to 1.575 V to match target system voltage rails.
• Package & Mounting: 484-FPBGA (23 × 23) package in a surface-mount form factor for space-efficient PCB integration.
• Industrial Temperature Range: Rated for operation from -40 °C to 100 °C, suitable for industrial environments.
• Regulatory Compliance: RoHS compliant.

Typical Applications

• Industrial Control: Implement custom logic, timing, and interface glue in factory automation and process control equipment.
• Embedded System Prototyping: Provide programmable logic and on-chip memory for algorithm development and system validation.
• Interface Bridging: Use the high I/O count to connect and translate between multiple peripheral buses and sensors.
• Instrumentation and Measurement: Integrate signal processing and control logic for experimental rigs and test equipment.

Unique Advantages

• High logic capacity: 13,824 logic elements and ~600,000 gates let you implement substantial custom digital designs without external ASICs.
• On-chip memory: Approximately 0.11 Mbits of embedded RAM supports local buffering and state storage to simplify system architecture.
• Generous I/O availability: 235 I/Os enable dense peripheral and signal connectivity on a single device.
• Industrial-grade operation: Specified for -40 °C to 100 °C operation to meet industrial environment needs.
• Compact BGA package: 484-FPBGA (23×23) surface-mount package minimizes PCB area while supporting high pin count.
• Flexible supply range: Broad operating voltage (1.14–1.575 V) facilitates integration with modern low-voltage systems.

Why Choose A3P600L-FG484I?

The A3P600L-FG484I positions itself as a practical choice for engineers and designers needing mid-range FPGA logic capacity with substantial I/O and embedded memory in an industrial-grade package. Its specification set supports a wide range of embedded and control-oriented designs where programmable logic, compact packaging, and extended temperature operation are required.

With Microchip Technology’s ProASIC3L offering, this device fits designs that require on-chip resources for custom logic and interfacing while maintaining a compact footprint and compliance with RoHS requirements.

Request a quote or submit an inquiry for pricing and availability of the A3P600L-FG484I to evaluate it for your next design.