A3P600L-1FGG484I

The A3P600L-1FGG484I is a ProASIC3L FPGA from Microchip Technology designed for industrial-grade embedded applications. It provides a mid-range programmable fabric with 13,824 logic elements, approximately 110,592 bits of on-chip RAM, and 235 I/O pins to implement custom logic, control, and interface functions.

With a nominal gate capacity of approximately 600,000 gates, a low-voltage supply range, and a compact 484-BGA package, the device balances integration density and board-level footprint for space-constrained industrial designs.

Key Features

• Core Logic 13,824 logic elements (LEs) delivering approximately 600,000 gates for implementing custom combinational and sequential logic.
• Embedded Memory Approximately 110,592 bits of on-chip RAM to support buffering, small data stores, and control-state memory.
• I/O Count 235 user I/O pins to support multiple interfaces, peripheral connections, and board-level signal routing.
• Power Supply Supports a core supply range of 1.14 V to 1.575 V to accommodate low-voltage system designs.
• Package & Mounting 484-BGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact PCB layouts.
• Operating Range Industrial-grade operating temperature from −40 °C to 100 °C suitable for a wide range of industrial environments.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control Implement custom control logic, signal conditioning, and protocol bridging in industrial automation systems that require industrial temperature operation.
• Data Aggregation & Interface Aggregate sensor or peripheral data and implement interface logic using the device’s high I/O count and on-chip memory.
• Embedded System Glue Logic Replace multiple discrete devices with programmable logic for board-level integration and reduced component count.

Unique Advantages

• Balanced Integration: 13,824 logic elements with approximately 110,592 bits of RAM provides a mid-range resource set for diverse embedded tasks without excessive board area.
• High I/O Capacity: 235 I/O pins allow flexible connectivity to peripherals, sensors, and external buses, simplifying interface design.
• Industrial Operating Range: Rated for −40 °C to 100 °C, supporting deployment in demanding industrial environments.
• Compact BGA Package: 484-BGA (484-FPBGA, 23×23) enables a small PCB footprint with surface-mount assembly compatibility.
• Low-Voltage Core: Core supply range of 1.14 V to 1.575 V supports modern low-voltage system architectures.
• RoHS Compliant: Meets lead-free manufacturing requirements for environmental compliance.

Why Choose A3P600L-1FGG484I?

The A3P600L-1FGG484I provides a practical mix of logic density, on-chip memory, and I/O capacity within a compact industrial-grade BGA package, making it suitable for embedded designs that need customizable logic without large FPGA footprints. Its industrial temperature rating and surface-mount 484-BGA form factor help designers target robust, space-conscious products.

Designed and manufactured by Microchip Technology, the device is positioned for engineers seeking a mid-range programmable solution with verified electrical and environmental characteristics for industrial applications.

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Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for the A3P600L-1FGG484I. Our team can provide lead-time information and help evaluate this FPGA for your design requirements.