A3P600L-1FGG144

The A3P600L-1FGG144 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, offered in a 144-LBGA surface-mount package. It provides a balance of programmable logic capacity, on-chip memory and GPIO integration for commercial embedded applications.

This device is suited for designs that require moderate logic density, built-in SRAM for buffering or state storage, and a compact BGA package. Key device attributes include 13,824 logic elements, approximately 0.11 Mbits of embedded memory, 97 user I/O pins and a 1.14 V–1.575 V supply range.

Key Features

• Logic Capacity  Provides 13,824 logic elements and approximately 600,000 gates to implement combinational and sequential logic functions.
• Embedded Memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for data buffering, lookup tables and small FIFOs.
• I/O Integration  97 user I/O pins to interface with peripherals, sensors and other digital subsystems.
• Packaging & Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact board layouts.
• Power  Operates from a 1.14 V to 1.575 V supply voltage range for core power configuration.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant, meeting common materials restrictions for electronics assembly.

Typical Applications

• Commercial Embedded Systems  Programmable logic for control, sequencing and custom processing in general-purpose embedded products.
• I/O Expansion and Glue Logic  Implement bus bridging, protocol adapters and interface conditioning using the available 97 I/O pins and programmable logic.
• Data Buffering and Small-State Storage  On-chip RAM supports temporary storage, look-up tables and small FIFO implementations.
• Compact Board Designs  144-LBGA surface-mount package enables higher-density PCB layouts where board space is limited.

Unique Advantages

• Balanced Logic and Memory:  13,824 logic elements paired with approximately 0.11 Mbits of embedded RAM enable a range of mid-density FPGA designs without external memory for small buffers.
• Substantial I/O Count:  97 user I/O pins allow direct interfacing to multiple peripherals and subsystems, reducing the need for external GPIO expanders.
• Compact BGA Package:  144-LBGA (144-FPBGA, 13×13) delivers a space-efficient footprint for modern PCB layouts while maintaining surface-mount assembly compatibility.
• Commercial Temperature and RoHS Compliance:  Commercial-grade operation from 0 °C to 85 °C and RoHS compliance support standard commercial manufacturing and deployment requirements.
• Clear Power Range:  Defined core supply range (1.14 V–1.575 V) aids power-supply design and integration into existing voltage domains.

Why Choose A3P600L-1FGG144?

The A3P600L-1FGG144 from Microchip Technology provides a practical combination of logic density, embedded RAM and I/O capability in a compact 144-LBGA surface-mount package. Its specification set addresses common needs in commercial embedded designs where moderate programmable logic, on-chip buffering and a high I/O count are required.

This FPGA suits teams and projects that require a reliably documented programmable device with clearly defined supply and temperature parameters, RoHS compliance and a form factor amenable to compact PCB designs. It is a good option for engineers seeking a mid-density, commercially graded FPGA for a range of embedded implementations.

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