A3P600L-1FG144

The A3P600L-1FG144 is a ProASIC3L field programmable gate array (FPGA) designed for commercial electronic designs requiring integrated programmable logic and on-chip memory. It provides 13,824 logic elements and approximately 0.11 Mbits of embedded memory alongside 97 general-purpose I/O pins in a compact 144-LBGA package.

With a supply voltage range of 1.14 V to 1.575 V and an operating temperature range of 0 °C to 85 °C, this device targets commercial-grade applications that need configurable logic density, embedded RAM, and a small surface-mount footprint.

Key Features

• Core Logic — 13,824 logic elements (equivalent to the device's configurable logic capacity) and approximately 600,000 gates to implement custom digital functions.
• Embedded Memory — 110,592 total RAM bits, providing approximately 0.11 Mbits of on-chip memory for buffering, state storage, and small data structures.
• I/O Count — 97 user I/O pins to support a variety of peripheral interfaces and system connections.
• Power Supply — Operates from 1.14 V to 1.575 V, enabling designs that require this low-voltage supply envelope.
• Package and Mounting — Available in a 144-LBGA package (supplier device package: 144-FPBGA, 13×13) with surface-mount mounting for compact board implementations.
• Temperature Grade — Commercial temperature range from 0 °C to 85 °C, suitable for standard commercial applications.
• Environmental Compliance — RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Commercial Embedded Systems — Implement configurable logic for control, data handling, and interface tasks in commercial equipment.
• Custom I/O Interfaces — Use the 97 I/O pins to create tailored interface bridges between sensors, displays, and processors.
• Prototyping and Development — Deploy the device where on-board programmable logic and embedded RAM are needed for proof-of-concept and evaluation.

Unique Advantages

• Substantial Logic Density: 13,824 logic elements provide a compact platform for implementing a wide range of digital functions without external logic.
• On-Chip Memory: Approximately 0.11 Mbits of embedded RAM reduces the need for external memory for small buffering and state storage tasks.
• Generous I/O Count: Ninety-seven I/O pins support versatile interfacing options, simplifying board-level connectivity.
• Compact Surface-Mount Package: The 144-LBGA / 144-FPBGA (13×13) package enables space-efficient PCB designs.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match standard commercial deployment requirements.
• Regulatory Compliance: RoHS compliant to support environmental and end-product compliance objectives.

Why Choose A3P600L-1FG144?

The A3P600L-1FG144 positions programmable logic, embedded RAM, and flexible I/O in a single, surface-mount 144-LBGA package for commercial designs. Its 13,824 logic elements, approximately 0.11 Mbits of on-chip memory, and 97 I/O pins make it a practical choice for engineers who need integrated logic capacity in a compact form factor.

This device suits customers developing commercial electronic products that require configurable digital functionality, reliable operation within a 0 °C to 85 °C range, and RoHS-compliant components. Its supply voltage range of 1.14 V to 1.575 V and compact package offer clear integration points for space- and power-constrained designs.

Request a quote or submit a purchase inquiry today to discuss availability and pricing for the A3P600L-1FG144. Our team can provide the information you need to move your design forward.