A3P600L-FG144

The A3P600L-FG144 is a ProASIC3L field programmable gate array (FPGA) IC from Microchip Technology. It provides 13,824 logic elements and approximately 110,592 bits of embedded RAM in a compact 144-LBGA package, enabling custom digital logic implementations with a moderate I/O count and gate capacity.

Designed for commercial-grade applications, this surface-mount FPGA operates from 1.14 V to 1.575 V and across a 0 °C to 85 °C temperature range, offering a balanced combination of integration density and package-level convenience for embedded system designs.

Key Features

• Core Logic  13,824 logic elements (LEs) providing capacity for approximately 600,000 equivalent gates to implement custom state machines, datapaths, and glue logic.
• Embedded Memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for FIFOs, buffers, and small data storage requirements.
• I/O Count  97 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
• Power Supply  Operates from 1.14 V to 1.575 V, compatible with a range of modern supply schemes.
• Package & Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB integration.
• Operating Conditions  Commercial grade operation from 0 °C to 85 °C suitable for typical industrial and consumer environments.
• Regulatory Compliance  RoHS compliant for lead-free manufacturing and environmental regulatory consistency.

Typical Applications

• Custom Digital Logic  Implement mid-range programmable logic functions using 13,824 logic elements and 97 I/Os for glue logic, protocol conversion, and control tasks.
• Embedded Memory Functions  Use the approximately 110,592 bits of embedded RAM for buffering, FIFOs, and small on-chip data storage within system designs.
• Interface and I/O Expansion  Leverage the 97 I/O pins to add or adapt peripheral interfaces and sensor connectivity without significant PCB redesign.
• Compact PCB Integration  The 144-LBGA (13×13) surface-mount package allows integration into space-constrained boards where package density matters.

Unique Advantages

• Balanced Logic Capacity: 13,824 logic elements and 600,000 equivalent gates provide substantial room for medium-complexity digital designs without over-specifying resources.
• On-Chip RAM Availability: Approximately 0.11 Mbits of embedded memory reduces the need for external RAM in many buffering and small-data scenarios.
• Generous I/O Count: 97 I/Os simplify peripheral interfacing and lower the need for external GPIO expanders.
• Compact, Surface-Mount Package: 144-LBGA (144-FPBGA 13×13) enables dense board layouts while keeping routing manageable.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match typical commercial-application deployment environments.
• RoHS Compliant: Designed for lead-free manufacturing and regulatory alignment.

Why Choose A3P600L-FG144?

The A3P600L-FG144 occupies a practical position for designers who need a mid-capacity FPGA with a solid mix of logic, embedded RAM, and I/O in a compact LBGA package. Its 13,824 logic elements and approximately 110,592 bits of on-chip memory make it well suited to custom digital functions, interface adaptation, and moderate buffering tasks without requiring larger, more costly devices.

This part is appropriate for teams seeking reliable, commercially graded programmable logic with clear electrical and thermal operating limits and RoHS compliance. It offers integration advantages for space-constrained PCBs and projects that require a balance between resource capacity and package footprint.

Request a quote or submit an inquiry to receive pricing and availability information for the A3P600L-FG144 and to discuss how it can fit into your next design.