A3P600L-FG144I

The A3P600L-FG144I is a ProASIC3L family FPGA from Microchip Technology designed for configurable digital logic implementations. It delivers moderate logic density and embedded memory in a compact 144-LBGA package suitable for surface-mount assembly.

With 13,824 logic elements, approximately 110.6 kbits of on-chip RAM, 97 user I/Os and a low-voltage supply range, this device is targeted at industrial applications that require low-voltage operation and an extended temperature range.

Key Features

• Core Logic  Provides 13,824 logic elements (cells) enabling implementation of custom combinational and sequential logic up to 600,000 gates.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 110.6 kbits) for buffering, state storage and small lookup tables.
• I/O Capacity  97 user I/Os to support multiple external interfaces and parallel connectivity.
• Power  Operates from a low-voltage supply range of 1.14 V to 1.575 V, allowing designs optimized for reduced core voltage domains.
• Package & Mounting  144-LBGA (supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for compact board-level integration.
• Temperature Range  Industrial-grade operating temperature from −40 °C to 100 °C to meet extended-temperature deployment needs.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Industrial control  Implement custom control logic, sequencing and I/O interfacing using 13,824 logic elements and 97 I/Os within an industrial temperature range.
• Embedded processing and prototyping  Use the device’s logic capacity and on-chip RAM for prototyping and deploying moderate-density programmable logic functions.
• Communication interface glue logic  Create protocol translators, bus bridging and interface adaptation leveraging available I/Os and logic resources.
• I/O expansion and peripheral control  Support multiple peripheral signals and custom I/O management in compact, surface-mount designs.

Unique Advantages

• Balanced logic density:  13,824 logic elements and 600,000 gates provide a mid-range capacity for many embedded logic tasks without excessive footprint.
• On-chip memory for state and buffering:  Approximately 110.6 kbits of RAM supports local data storage and small lookup tables, reducing external memory needs.
• Low-voltage operation:  1.14 V to 1.575 V supply range enables designs that target reduced core voltage domains and conservative power budgets.
• Industrial temperature capability:  Rated from −40 °C to 100 °C for reliability in extended-temperature environments.
• Compact package:  144-LBGA / 144-FPBGA (13×13) surface-mount package simplifies board layout for space-constrained applications.
• Regulatory readiness:  RoHS compliance supports lead-free manufacturing flows.

Why Choose A3P600L-FG144I?

The A3P600L-FG144I combines a practical mix of logic resources, embedded memory and I/O capacity in a compact 144-LBGA package, making it suitable for industrial and embedded designs that require moderate programmable logic density. Its low-voltage operation and extended temperature rating help designers meet power and environmental constraints while keeping board area and component count under control.

Manufactured by Microchip Technology, this FPGA is a viable option for projects needing configurable logic, local buffering and flexible I/O in surface-mount form factors where industrial-grade temperature performance and RoHS compliance are required.

If you would like pricing, availability or to request a quote for the A3P600L-FG144I, submit an inquiry or request a quote through your preferred procurement channel. Our team can provide lead-time and ordering information.