A3P600-FGG484

The A3P600-FGG484 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology. It provides a fixed-density FPGA fabric with 13,824 logic elements and approximately 0.11 Mbits (110,592 bits) of embedded RAM to implement configurable digital logic.

With 235 general-purpose I/O pins, a 484-pin FBGA package (23 × 23), a supply range of 1.425 V to 1.575 V, and a commercial operating temperature range of 0 °C to 85 °C, this device is targeted at designs that require substantial logic capacity and I/O integration in a compact surface-mount package.

Key Features

• Logic Capacity 13,824 logic elements (LEs) and approximately 600,000 logical gates provide capacity for mid-density digital designs and custom logic implementations.
• Embedded Memory 110,592 bits of on-chip RAM (≈0.11 Mbits) for local buffering, state storage, and small data structures without external memory.
• I/O Integration 235 I/O pins allow integration of multiple interfaces, parallel buses, and sensor or peripheral connectivity within a single device.
• Package and Mounting 484-pin FBGA (23 × 23) package in a surface-mount format provides a compact footprint for board-level integration.
• Power Supply Operates from a core supply range of 1.425 V to 1.575 V, enabling predictable power budgeting for core logic.
• Operating Range Commercial grade with an operating temperature range of 0 °C to 85 °C for standard embedded and electronic applications.
• Environmental Compliance RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

• Complex digital logic designs — Implement custom finite state machines, signal processing blocks, or glue logic using up to 13,824 logic elements and on-chip RAM.
• High-density I/O integration — Consolidate multiple peripheral interfaces and parallel connections with 235 available I/O pins in a single device.
• Embedded control and interfacing — Use on-chip memory and logic resources for local buffering, control loops, and protocol handling without immediate need for external memory.

Unique Advantages

• Substantial logic density: 13,824 logic elements and 600,000 gates offer the capacity to implement significant custom logic within a single FPGA.
• On-chip memory for efficient designs: Approximately 0.11 Mbits of embedded RAM reduces reliance on external memory for small buffers and state storage.
• High I/O count: 235 I/Os enable consolidation of multiple interfaces and simplify board-level routing compared with multiple discrete devices.
• Compact surface-mount package: 484-pin FBGA (23 × 23) provides a dense package option for space-constrained PCBs.
• Commercial operational profile: Rated for 0 °C to 85 °C and RoHS compliant to align with standard electronic product requirements.

Why Choose A3P600-FGG484?

The A3P600-FGG484 delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 484-FP BGA package, making it suitable for designers who need substantial programmable logic and connectivity without external memory overhead. Its defined supply range and commercial temperature rating make it appropriate for a wide range of standard embedded and electronic applications.

As part of the ProASIC3 family from Microchip Technology, this device is positioned for projects that require predictable logic resources, a high I/O count, and compliance with lead-free manufacturing practices.

Request a quote or submit an inquiry to obtain pricing and availability for the A3P600-FGG484 and to discuss how it can fit your next design.