A3P600-FGG256I

The A3P600-FGG256I is a ProASIC3 field programmable gate array (FPGA) supplied in a 256-LBGA package. It delivers a mid-range logic capacity with 600,000 gates, 13,824 logic elements and approximately 0.11 Mbits of on‑chip RAM, paired with 177 I/O pins for board-level integration.

Designed for industrial-grade operation, the device supports a 1.425 V to 1.575 V supply range and an operating temperature of -40°C to 100°C, and is RoHS compliant.

Key Features

• Core Capacity  600,000 gates and 13,824 logic elements provide the programmable fabric needed for medium-complexity digital designs.
• Embedded Memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for local data buffering and state storage.
• I/O Density  177 available I/O pins to interface with external peripherals, sensors, and memory devices.
• Power  Nominal supply voltage range of 1.425 V to 1.575 V to match low-voltage system domains.
• Package & Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board layouts.
• Temperature & Grade  Industrial grade device with an operating range from -40°C to 100°C for deployments in demanding environments.
• Compliance  RoHS compliant for use in assemblies requiring environmental compliance.

Unique Advantages

• High logic and memory integration: Combines 600,000 gates, 13,824 logic elements and embedded RAM to consolidate functions on a single device and reduce component count.
• Substantial I/O capacity: 177 I/Os enable a wide range of direct peripheral and bus connections without additional expansion logic.
• Compact, surface-mount package: 256-LBGA (17×17 FPBGA) supports dense board layouts while maintaining a standard SMT footprint.
• Industrial temperature range: Rated from -40°C to 100°C to meet reliability requirements for industrial deployments.
• Low-voltage compatibility: 1.425 V–1.575 V supply range facilitates integration into modern low-voltage power domains.
• RoHS compliance: Supports environmentally restricted product assemblies.

Why Choose A3P600-FGG256I?

The A3P600-FGG256I positions itself as a mid-range ProASIC3 FPGA option for designs that require a balance of logic capacity, embedded memory and I/O density within an industrial temperature envelope. Its combination of 600,000 gates, 13,824 logic elements, and 177 I/Os supports consolidated implementation of control, interfacing and processing functions on a single package.

This device is well suited for teams seeking to reduce board-level BOM and simplify routing through high on-chip integration while maintaining industrial-grade operating range and RoHS compliance.

Request a quote or submit a pricing inquiry for the A3P600-FGG256I to receive availability and ordering information.