A3P600-FGG256

The A3P600-FGG256 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a combination of logic density, embedded memory, and a high I/O count in a compact 256-LBGA package.

Key device characteristics include 13,824 logic elements, approximately 110,592 bits of on-chip RAM, 177 I/Os, a 1.425 V–1.575 V supply range, and a commercial operating temperature range of 0 °C to 85 °C — delivered in a surface-mount 256-FPBGA (17×17) package. The device is RoHS compliant.

Key Features

• Core Logic Provides 13,824 logic elements and approximately 600,000 gates to implement custom digital logic and control functions.
• On-Chip Memory Approximately 110,592 bits (≈0.11 Mbits) of embedded RAM for buffering, small data tables, and state storage.
• I/O Count 177 I/Os to support multiple external interfaces and signal routing requirements.
• Package & Mounting Supplied in a 256-LBGA package (supplier device package: 256-FPBGA, 17×17) and designed for surface-mount assembly.
• Power Operates from a supply voltage in the range of 1.425 V to 1.575 V to accommodate low-voltage system domains.
• Temperature & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant for environmental and manufacturing process alignment.

Unique Advantages

• High Logic Density: 13,824 logic elements enable implementation of substantial custom logic within a single FPGA, reducing external component count.
• Integrated On-Chip RAM: Approximately 0.11 Mbits of embedded RAM provides local storage for state machines, buffers, and small data structures without external memory.
• Generous I/O Capability: 177 I/Os support multiple peripheral connections and signal interfaces from one device footprint.
• Compact, Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) offers a space-efficient package compatible with standard PCB assembly processes.
• Low-Voltage Operation: Narrow supply range (1.425 V–1.575 V) aligns with low-voltage digital domains for power-conscious designs.
• RoHS Compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose A3P600-FGG256?

The A3P600-FGG256 targets designs that require a balance of logic capacity, on-chip memory, and a high I/O count in a compact, surface-mount package. Its specification set — including 13,824 logic elements, approximately 110,592 bits of RAM, 177 I/Os, and a 256-LBGA package — makes it a practical choice for projects that need integrated digital resources within a commercial temperature range.

Backed by Microchip Technology, this ProASIC3 FPGA offers designers a traceable configuration of capabilities and compliance attributes (RoHS) that support straightforward integration into production assemblies where the listed electrical, thermal, and package characteristics match system requirements.

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