A3P600-FG484

The A3P600-FG484 is a ProASIC3 field programmable gate array (FPGA) IC providing a mid-range logic density and extensive I/O in a compact ball-grid array package. It integrates 600,000 gates across 13,824 logic elements with on-chip embedded RAM to support commercial embedded applications requiring flexible, reprogrammable logic.

Designed for commercial-grade deployments, the device offers 235 user I/Os, a 484-FPBGA (23 × 23) footprint for surface-mount assembly, RoHS compliance, and operating support across a core voltage range of 1.425 V to 1.575 V and temperatures from 0 °C to 85 °C.

Key Features

• Core Logic  Provides 600,000 gates implemented as 13,824 logic elements, enabling medium-complexity programmable logic designs.
• Embedded Memory  Approximately 0.11 Mbits of total on-chip RAM (110,592 bits) to support buffering, state storage, and small lookup tables.
• I/O Capacity  235 user I/Os for broad peripheral and interface connectivity within a single device.
• Package & Mounting  484-BGA package in a 484-FPBGA (23×23) supplier footprint; intended for surface-mount PCB assembly.
• Power Supply  Core supply supported from 1.425 V to 1.575 V to match targeted system power domains.
• Commercial Temperature Grade  Specified operating temperature range of 0 °C to 85 °C for commercial applications.
• Regulatory Compliance  RoHS compliant for reduced environmental hazard in assembly and disposal.

Typical Applications

• Commercial Embedded Systems  Implements custom logic functions and interface glue for mid-range embedded products where reprogrammability and I/O density are required.
• Consumer Electronics  Provides programmable control and peripheral aggregation for consumer devices that need moderate logic capacity and multiple I/Os.
• Communication Equipment  Supports protocol bridging and custom packet-processing logic leveraging the device's logic elements and on-chip RAM.
• Development & Prototyping  Serves as a reprogrammable platform for validating logic architectures and peripheral integration before production design finalization.

Unique Advantages

• Significant Logic Density:  600,000 gates and 13,824 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Integrated On-chip Memory:  Approximately 0.11 Mbits of embedded RAM supports buffering and state machines without external memory.
• High I/O Count:  235 I/Os enable direct interfacing to a wide range of peripherals and buses, minimizing the need for additional I/O expanders.
• Compact Surface-Mount Packaging:  484-FPBGA (23×23) package delivers high-pin-count in a compact footprint suitable for dense board layouts.
• Commercial-Grade Qualification:  Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial product requirements.
• Controlled Core Supply:  Defined 1.425 V to 1.575 V core supply range for predictable power integration into commercial systems.

Why Choose A3P600-FG484?

The A3P600-FG484 positions itself as a practical ProASIC3 FPGA option for designers who need a balance of logic capacity, on-chip memory, and abundant I/O in a commercial-grade device. Its combination of 600,000 gates, 13,824 logic elements, approximately 0.11 Mbits of RAM, and 235 I/Os lets teams consolidate functions and streamline board-level design.

This device is well suited to commercial embedded and consumer applications where reprogrammable logic, moderate gate counts, and a compact 484-BGA package deliver long-term design flexibility and simplified BOM management.

If you would like pricing or availability for the A3P600-FG484, request a quote or submit an inquiry and our team will respond with details to support your procurement and design planning.