A3P600-FG256

The A3P600-FG256 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology, delivered in a 256-LBGA package. It provides up to 600,000 gates and 13,824 logic elements for commercial-grade embedded logic integration.

Designed for commercial applications requiring mid-range density, the device combines a high I/O count and embedded RAM to support data buffering, control logic, and custom peripheral integration within a surface-mount 256-FPBGA (17×17) package.

Key Features

• Logic Capacity — 13,824 logic elements (LABs/CLBs) and approximately 600,000 gates to implement medium-complexity digital designs.
• Embedded Memory — Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for buffering, state storage, and small lookup tables.
• I/O Density — 177 user I/Os to support multiple interfaces, peripheral connections, and parallel signals.
• Package and Mounting — 256-LBGA package (supplier package: 256-FPBGA, 17×17) optimized for surface-mount assembly and compact board integration.
• Power — Core supply range of 1.425 V to 1.575 V to match system power domains requiring low-voltage FPGA cores.
• Commercial Temperature Range — Rated for 0°C to 85°C operation, appropriate for commercial-grade environments.
• RoHS Compliance — Environmentally compliant with RoHS requirements.

Typical Applications

• Commercial Embedded Systems — Implement control logic and custom peripherals in compact, surface-mount assemblies where mid-range gate density is required.
• Communications Equipment — Use the 177 I/Os and on-chip RAM for protocol bridging, interface adaptation, and signal routing in commercial networking gear.
• Consumer Electronics — Integrate custom logic, feature control, and I/O aggregation in consumer products designed for the 0°C–85°C commercial temperature range.

Unique Advantages

• High logic density in a compact package: 13,824 logic elements and 600,000 gates enable substantial functionality within a 256-LBGA footprint, reducing PCB area and BOM complexity.
• Ample I/O for system integration: 177 I/Os support multiple external interfaces and parallel signal connections without external glue logic.
• Embedded RAM for local buffering: Approximately 0.11 Mbits of on-chip memory supports temporary data storage and state machines, minimizing external memory requirements.
• Low-voltage core operation: 1.425 V–1.575 V supply range aligns with modern low-voltage designs and power domains.
• Commercial-grade qualification: Rated for 0°C–85°C operation and RoHS compliant, suitable for a wide range of commercial applications.
• Surface-mount 256-FPBGA (17×17): Package choice supports automated manufacturing and high-density board designs.

Why Choose A3P600-FG256?

The A3P600-FG256 balances significant logic capacity and I/O density with a compact 256-LBGA package for commercial embedded designs. Its combination of 13,824 logic elements, 177 I/Os, and approximately 0.11 Mbits of embedded RAM makes it well suited for applications that require medium-complexity programmable logic without moving to higher device classes.

For designers targeting commercial-temperature systems and surface-mount production, the A3P600-FG256 offers a practical mix of integration, configurable logic resources, and compliance with RoHS, delivering a scalable FPGA option within the ProASIC3 family.

Request a quote or submit a pricing inquiry today to evaluate the A3P600-FG256 for your next commercial FPGA design.