A3P600-2PQG208I

The A3P600-2PQG208I is a ProASIC3 family FPGA from Microchip Technology offering a medium-density, flash-based programmable fabric. It delivers 13,824 logic elements, approximately 0.11 Mbits of embedded RAM, and 154 user I/Os in a surface-mount 208-pin BFQFP package suitable for industrial applications.

Designed for applications that require deterministic, reprogrammable logic at industrial temperature ranges, this device provides a balance of logic capacity, on-chip memory, I/O count, and a low-voltage core supply.

Key Features

• Logic Capacity  13,824 logic elements providing synthesisable resources for mid-range FPGA designs and custom logic implementation.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for FIFOs, buffers, and small data stores.
• Gate Equivalence  Device contains 600,000 gates to support combinational and sequential logic requirements.
• Rich I/O  154 user I/Os to interface with peripherals, sensors, and external buses without external glue logic.
• Package & Mounting  208-pin BFQFP surface-mount package (supplier package listed as 208-PQFP, 28×28) for compact board-level integration.
• Power Supply  Core voltage range of 1.425 V to 1.575 V for low-voltage power architectures.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Implement custom control logic, deterministic state machines, and I/O aggregation for factory automation and process control systems.
• Communications Equipment  Protocol bridging, packet preprocessing, or custom interface logic where moderate logic and abundant I/Os are required.
• Instrumentation & Test  On-board data handling, signal routing, and timing logic for test instruments and measurement systems operating in industrial environments.
• Embedded Systems  Hardware acceleration and peripheral glue logic in embedded platforms that benefit from reprogrammability and integrated RAM.

Unique Advantages

• Highly integrated mid-range logic: 13,824 logic elements and 600,000 gates minimize the need for external CPLDs or discrete logic in many designs.
• Compact board footprint: 208-pin BFQFP surface-mount package enables dense PCB layouts while providing ample I/O.
• Industrial-ready thermal range: Specified operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Low-voltage core operation: 1.425–1.575 V supply range aligns with modern low-voltage power rails to help reduce system power consumption.
• On-chip RAM for buffering: Approximately 0.11 Mbits of embedded memory supports FIFOs, small tables, and local data storage without external RAM.
• RoHS compliance: Environmentally compliant manufacturing and materials.

Why Choose A3P600-2PQG208I?

The A3P600-2PQG208I positions itself as a reliable, industrial-grade FPGA option for engineers needing a balanced combination of logic capacity, on-chip memory, and plentiful I/O in a compact package. Its operating temperature range and RoHS compliance make it suitable for deployed systems that must operate across a wide set of conditions.

Backed by Microchip Technology, this device is appropriate for designers building industrial control systems, communications equipment, instrumentation, and embedded platforms that require reprogrammable logic with predictable electrical and thermal characteristics.

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