A3P600-FG144

The A3P600-FG144 is a ProASIC3 field programmable gate array from Microchip Technology, offering 13,824 logic elements and approximately 600,000 gates of configurable logic. With 97 user I/O pins and about 110,592 bits (≈0.11 Mbits) of on-chip RAM, it targets commercial embedded designs that require mid-range logic density, on-chip memory and a compact BGA package.

Designed for surface-mount assembly in a 144-LBGA footprint with a 13×13 144-FPBGA supplier package, the device operates from a 1.425–1.575 V supply rail and supports commercial-temperature deployments from 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Density 13,824 logic elements providing approximately 600,000 gates of configurable logic capacity for custom digital functions.
• On-chip Memory Approximately 0.11 Mbits (110,592 bits) of embedded RAM to support buffering, state machines and small data storage.
• I/O Count 97 user I/O pins to support multiple external interfaces and peripheral connections.
• Power Core voltage supply range of 1.425 V to 1.575 V to match low-voltage digital power rails.
• Package and Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB integration.
• Operating Range Commercial-grade operating temperature of 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance RoHS compliant.

Typical Applications

• Embedded Control Systems — Implement custom control logic and finite-state machines using the device's 13,824 logic elements and on-chip RAM.
• Peripheral and Interface Bridging — Use the 97 I/O pins to bridge between sensors, memory, and external peripherals in compact systems.
• Prototyping and Custom Logic — Mid-range gate and memory capacity suited for prototyping or production of custom digital functions in commercial products.

Unique Advantages

• Balanced Logic and Memory Density: 13,824 logic elements combined with ~0.11 Mbits of RAM provide a middle-ground resource mix for many commercial designs.
• Ample I/O Count: Ninety-seven user I/O pins enable integration with multiple external devices without additional interface chips.
• Compact BGA Footprint: 144-LBGA / 144-FPBGA (13×13) package reduces board area while supporting surface-mount assembly.
• Low-voltage Core Compatibility: Core supply range of 1.425–1.575 V aligns with modern low-voltage digital power supplies.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial deployments and regulatory alignment.

Why Choose A3P600-FG144?

The A3P600-FG144 delivers a practical combination of logic capacity, embedded memory and I/O resources in a compact BGA package, making it well suited to commercial embedded designs that require mid-range programmable logic. Its supply voltage and temperature rating align with common commercial system requirements, and RoHS compliance supports environmental standards.

Manufactured by Microchip Technology, the device is positioned for designers and OEMs who need a reliable, mid-density FPGA option for custom digital functions, interface bridging and prototyping within commercial product lines.

Request a quote or submit your purchase inquiry today to check availability and pricing for the A3P600-FG144.