A3P600-2FGG484

The A3P600-2FGG484 is a ProASIC3 family Field Programmable Gate Array (FPGA) IC designed for reconfigurable digital logic implementations. It provides a balance of logic capacity, embedded memory, and I/O density in a commercial-grade, surface-mount 484-BGA package.

Key Features

• Core Logic 13,824 logic elements (LEs) providing programmable resources for custom digital functions and glue logic.
• Embedded Memory Approximately 0.11 Mbits of embedded memory (110,592 total RAM bits) to support on-chip data buffering and small lookup tables.
• I/O Density 235 user I/Os to accommodate broad connectivity requirements for peripherals, sensors, and external devices.
• Gate Count 600,000 gates, enabling moderate-complexity logic integration in a single device.
• Power Operates from a supply voltage range of 1.425 V to 1.575 V for core power budgeting and system design.
• Package and Mounting Available in a 484-BGA package (supplier device package: 484-FPBGA 23×23) with surface-mount mounting for compact PCB integration.
• Operating Range Commercial-grade operating temperature range of 0 °C to 85 °C for standard embedded and consumer environments.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Embedded System Logic Implement custom control paths, protocol handling, and glue logic within embedded controllers and subsystem boards.
• Interface Aggregation Consolidate multiple peripheral interfaces and manage signal routing where a high I/O count is required.
• Prototyping and Development Use the device for hardware validation and proof-of-concept designs that require reconfigurable logic resources and on-chip memory.

Unique Advantages

• High Logic Capacity: 13,824 logic elements allow significant combinational and sequential logic to be implemented on-chip, reducing external components.
• On-Chip Memory: Approximately 0.11 Mbits of embedded RAM supports local buffering and state storage without immediate reliance on external memory.
• Large I/O Count: 235 I/Os provide flexibility for multi-channel interfacing and board-level consolidation.
• Compact BGA Package: The 484-BGA (23×23) package enables dense PCB placement and supports surface-mount assembly processes.
• Predictable Power Envelope: Specified core supply range (1.425 V–1.575 V) aids in power supply selection and thermal planning.
• Regulatory Compliance: RoHS compliance supports environmentally conscious production and broader sourcing acceptance.

Why Choose A3P600-2FGG484?

The A3P600-2FGG484 positions itself as a practical, commercial-grade FPGA option when designers need a solid mix of logic capacity, embedded memory, and high I/O in a compact BGA footprint. Its 13,824 logic elements, 110,592 bits of on-chip RAM, and 235 I/Os make it suitable for designs that require substantial on-chip integration without moving to larger or more complex device families.

This device is well suited to engineers and teams building embedded systems, interface concentrators, and proof-of-concept hardware where predictable operating conditions (0 °C to 85 °C) and a controlled supply range matter. The combination of package density and RoHS compliance supports efficient board-level integration and manufacturing workflows.

Request a quote or submit a pricing inquiry to begin evaluating A3P600-2FGG484 for your next design project.