A3P600-2FGG256I

The A3P600-2FGG256I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered in a 256-LBGA package. It delivers 600,000 gates and 13,824 logic elements with approximately 0.11 Mbits of embedded memory and 177 user I/Os.

Designed and specified for industrial applications, this surface-mount FPGA supports a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of -40°C to 100°C, and is RoHS compliant.

Key Features

• Logic Capacity  Provides 13,824 logic elements (CLBs) and 600,000 gates to implement mid-density programmable logic designs.
• Embedded Memory  Includes approximately 0.11 Mbits of on-chip RAM for data buffering and state storage within user designs.
• I/O Resources  Offers 177 user I/Os to support multiple external interfaces and system connections.
• Power Supply  Operates from a supply voltage range of 1.425 V to 1.575 V, enabling predictable power design and regulation.
• Package & Mounting  Supplied in a 256-LBGA (supplier package: 256-FPBGA, 17×17) for surface-mount PCB assembly.
• Temperature & Grade  Specified for industrial operation from -40°C to 100°C and listed with an industrial grade.
• Regulatory Compliance  RoHS compliant to meet standard environmental requirements.

Typical Applications

• Industrial Control  Use the A3P600-2FGG256I to implement control logic and I/O aggregation in industrial systems that require operation across -40°C to 100°C.
• Embedded Systems  Deploy mid-density programmable logic and on-chip RAM for custom processing, glue logic, or protocol bridging in embedded designs.
• Communication Interfaces  Leverage the 177 I/Os to connect multiple external devices and implement custom interface logic in communication equipment.

Unique Advantages

• Balanced Logic and Memory:  13,824 logic elements combined with approximately 0.11 Mbits of embedded RAM provide a compact platform for moderate-complexity designs.
• Generous I/O Count:  177 user I/Os simplify integration with sensors, actuators, and peripheral devices, reducing the need for external multiplexers.
• Industrial Temperature Range:  Rated from -40°C to 100°C to support reliable operation in demanding environments.
• Compact Surface-Mount Package:  256-LBGA (17×17 FPBGA) enables high-density board layouts while maintaining robust solderability for surface-mount assembly.
• Standards Compliance:  RoHS compliance supports environmental and regulatory objectives for manufactured products.

Why Choose A3P600-2FGG256I?

The A3P600-2FGG256I positions itself as a mid-density, industrial-grade FPGA solution that combines 600,000 gates, 13,824 logic elements, and a high I/O count in a compact 256-LBGA package. Its defined supply voltage range and wide operating temperature window make it suitable for industrial and embedded designs that require reliable programmable logic and moderate on-chip RAM.

This device is appropriate for engineers and product teams seeking a stable, RoHS-compliant FPGA platform with ample I/O and logic resources for control, interface, and custom-processing tasks, while maintaining a compact footprint for PCB integration.

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