A3P600-2FG484I

The A3P600-2FG484I is a ProASIC3 field programmable gate array manufactured by Microchip Technology. It provides a mid-range programmable logic solution with 600,000 gates and 13,824 logic elements for custom digital designs.

Designed for industrial use, the device offers 235 I/O pins, approximately 0.11 Mbits of embedded RAM, a 484-ball BGA package (484-FPBGA, 23×23), surface-mount mounting, RoHS compliance, and an operating range of –40 °C to 100 °C with a core supply of 1.425 V to 1.575 V.

Key Features

• FPGA Core  600,000 gates and 13,824 logic elements provide programmable logic capacity for mid-complexity designs.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for block storage and small data buffering.
• I/O Density  235 general-purpose I/O pins to support multiple peripherals, interfaces, and board-level signal routing.
• Package & Mounting  484-BGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board integration.
• Power  Narrow core voltage supply range of 1.425 V to 1.575 V for defined power planning and regulation design.
• Temperature & Grade  Industrial-grade device rated for operation from –40 °C to 100 °C.
• Regulatory  RoHS-compliant for reduced-hazard materials and regulatory alignment.

Typical Applications

• Industrial Control  Programmable logic and I/O capacity suited to control, monitoring, and automation systems operating across industrial temperature ranges.
• High-density I/O Systems  Boards that require many external connections can leverage 235 I/Os for sensor, actuator, or peripheral interfacing.
• Custom Logic and Prototyping  Mid-range gate count and logic element capacity support custom state machines, protocol handling, and hardware acceleration tasks.
• Embedded System Integration  Compact 484-BGA package and surface-mount mounting make the device suitable for space-constrained embedded PCBs needing programmable logic.

Unique Advantages

• Balanced Logic Capacity:  600,000 gates and 13,824 logic elements provide a practical balance of resources for mid-complexity functions without excessive board-level fragmentation.
• Significant I/O Count:  With 235 I/Os, the device reduces the need for external I/O expanders and simplifies system-level connectivity.
• Compact BGA Footprint:  484-FPBGA (23×23) packaging offers a high-density assembly option for compact designs.
• Industrial Temperature Range:  Rated from –40 °C to 100 °C to meet many industrial environmental requirements.
• Predictable Power Requirements:  A defined supply range (1.425 V–1.575 V) simplifies power-supply selection and regulation design.
• RoHS Compliance:  Helps streamline material compliance for global manufacturing and product deployment.

Why Choose A3P600-2FG484I?

The A3P600-2FG484I positions itself as a reliable mid-range ProASIC3 FPGA suited to industrial and embedded designs that require a combination of logic density, I/O capacity, and compact packaging. Its 600k-gate core and 13,824 logic elements provide determinable resources for developers implementing custom logic blocks, protocol handlers, and peripheral interfaces.

Engineers specifying this device will benefit from its industrial temperature rating, narrow core-voltage window for controlled power design, and packaged form factor that supports dense PCB layouts. The A3P600-2FG484I is appropriate for teams seeking a Microchip Technology FPGA with measurable, verifiable specifications for production-level embedded and industrial systems.

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