A3P600-2FG484

The A3P600-2FG484 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It integrates 13,824 logic elements and approximately 0.11 Mbits of embedded memory to support complex glue logic, protocol implementation, and custom digital functions.

Packaged in a 484-FPBGA (23×23) surface-mount package with 235 I/Os and a supply voltage range of 1.425 V–1.575 V, this device is targeted at commercial embedded designs that require a balance of logic density, I/O capability, and compact package integration.

Key Features

• Core Logic 13,824 logic elements providing up to 600,000 gates for implementing custom digital architectures and control logic.
• Embedded Memory Approximately 0.11 Mbits of on-chip RAM suitable for buffering, small FIFOs, and lookup tables.
• I/O Capacity 235 user I/O pins to support wide interfacing options with peripherals, sensors, and external logic devices.
• Power Single supply operation in the range 1.425 V–1.575 V for designs targeting this low-voltage domain.
• Package & Mounting 484-FPBGA (23×23) surface-mount package (484-BGA) for high-density board integration.
• Temperature & Grade Commercial grade operation from 0 °C to 85 °C for mainstream embedded applications.
• Compliance RoHS compliant for lead-free manufacturing and environmental requirements.

Typical Applications

• Commercial Embedded Systems — Implement control logic, protocol bridging, or custom data processing in compact board-level designs.
• Communications Equipment — Provide interface glue and custom packet handling using the device's I/O density and logic resources.
• Test & Measurement — Realize timing-critical state machines and I/O routing for instrumentation and lab equipment.
• Prototyping and Development — Validate digital designs and iterate on hardware functions with a configurable logic resource set.

Unique Advantages

• High Logic Density: 13,824 logic elements enable substantial on-chip logic integration, reducing the need for multiple discrete devices.
• Generous I/O Count: 235 I/Os support complex board-level interfacing and multiple peripheral connections without external expander chips.
• Embedded Memory: Approximately 0.11 Mbits of on-chip RAM for local buffering and small data structures, simplifying external memory requirements.
• Compact BGA Package: 484-FPBGA (23×23) surface-mount package delivers dense integration for space-constrained PCBs.
• Low-Voltage Operation: Supported supply range of 1.425 V–1.575 V aligns with low-voltage system designs.
• Commercial Temperature Rating & RoHS Compliance: 0 °C–85 °C operation and RoHS compliance for mainstream commercial manufacturing and deployment.

Why Choose A3P600-2FG484?

The A3P600-2FG484 positions itself as a practical choice for commercial embedded designs that require a balanced combination of logic capacity, on-chip memory, and a high I/O count in a compact BGA package. Its specification set supports a wide range of board-level functions where integration and I/O flexibility matter.

Backed by Microchip Technology, the device offers designers a reliable FPGA option for projects that demand measurable logic resources, moderate embedded RAM, and standard commercial-temperature operation—helping simplify BOMs and PCB layout while meeting RoHS requirements.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the A3P600-2FG484.