A3P600-2FG144

The A3P600-2FG144 is a ProASIC3 flash-based FPGA from Microchip Technology, providing a balance of logic capacity, embedded memory and I/O count in a compact BGA package. It delivers 13,824 logic elements (equivalent to 600,000 gates) and approximately 0.11 Mbits of on-chip RAM, making it suitable for designs that require moderate programmable logic and local buffering.

Packaged as a 144-pin LBGA (supplier package: 144-FPBGA 13×13) and rated for commercial operation, the device supports a 1.425 V to 1.575 V core supply and offers 97 user I/Os for system interfacing. The part is RoHS compliant and intended for surface-mount assembly processes.

Key Features

• Logic Capacity  13,824 logic elements (reported) and a total of 600,000 equivalent gates provide substantial programmable logic resources for combinational and sequential designs.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for local data storage, buffering and small lookup tables.
• I/O Resources  97 general-purpose I/Os to support a variety of peripheral and signal interfacing requirements.
• Power and Supply  Core voltage range of 1.425 V to 1.575 V to match target system power rails and design constraints.
• Package and Mounting  144-LBGA package (supplier device package 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB layouts.
• Operating Range  Commercial temperature rating from 0°C to 85°C for general-purpose applications.
• Environmental Compliance  RoHS compliant construction to meet standard environmental requirements.

Typical Applications

• Custom Logic and Control  Implement state machines, glue logic and custom control functions using the device's 13,824 logic elements.
• Interface Expansion  Use the 97 I/Os to add parallel or serial interfaces, front-panel controls, or peripheral connectivity on compact boards.
• On-Chip Data Buffering  Employ approximately 0.11 Mbits of embedded RAM for small buffering, FIFOs or lookup-table storage within system data paths.
• Prototyping and Development  Leverage the programmable nature of the ProASIC3 device for iterative design development and hardware validation.

Unique Advantages

• Substantial Logic Density:  13,824 logic elements and 600,000 equivalent gates provide the capacity to implement complex logic without multiple discrete components.
• On-Chip Memory:  110,592 bits of embedded RAM enable local data handling and reduce dependence on external memory for small storage needs.
• Generous I/O Count:  97 user I/Os support diverse peripheral connections and board-level integration.
• Compact Surface-Mount Package:  144-LBGA (144-FPBGA 13×13) balances board space efficiency with manufacturability for surface-mount assembly.
• Commercial Temperature Grade:  Rated 0°C to 85°C to suit a wide range of commercial electronic applications.
• RoHS Compliant:  Manufactured to meet RoHS environmental requirements.

Why Choose A3P600-2FG144?

The A3P600-2FG144 offers a mid-range ProASIC3 FPGA configuration that combines ample logic elements, on-chip RAM and a high I/O count in a space-efficient 144-LBGA package. Its electrical and mechanical specifications—core voltage range of 1.425 V to 1.575 V, surface-mount 144-FPBGA (13×13) package, and commercial temperature rating—make it a practical choice for designs that need programmable logic with integrated memory and multiple I/Os.

This device suits engineers and procurement teams looking for a RoHS-compliant, flash-based FPGA option from Microchip Technology that supports iterative development, interface consolidation and moderate buffering needs while maintaining a compact PCB footprint.

Request a quote or submit a pricing inquiry to evaluate the A3P600-2FG144 for your next design project.