A3P600-1PQ208
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 154 110592 208-BFQFP |
|---|---|
| Quantity | 349 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 154 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of A3P600-1PQ208 – ProASIC3 FPGA, 600,000 gates, 208-BFQFP
The A3P600-1PQ208 is a Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a mid-range integration point with 13,824 logic elements and 600,000 gates for implementing complex digital logic in commercial designs.
With approximately 0.11 Mbits of embedded memory, 154 I/O pins, a compact 208-BFQFP (28 × 28) surface-mount package, and a defined supply range of 1.425 V to 1.575 V, this device targets commercial embedded systems, communications equipment, consumer electronics, and development/prototyping projects that require a balance of logic capacity and I/O.
Key Features
- Core Logic — 13,824 logic elements delivering 600,000 gates to implement medium-complexity digital designs.
- Embedded Memory — 110,592 total RAM bits, approximately 0.11 Mbits of on-chip memory for data buffering and state storage.
- I/O Count — 154 general-purpose I/O pins to interface with sensors, peripherals, and external logic.
- Power — Specified voltage supply range of 1.425 V to 1.575 V for core operation.
- Package & Mounting — 208-BFQFP (208-PQFP, 28 × 28) surface-mount package for board-level integration.
- Operating Range — Commercial operating temperature from 0 °C to 85 °C.
- Regulatory — RoHS compliant for lead-free assembly and regulatory alignment.
Typical Applications
- Embedded Systems — Implements custom control, protocol handling, and glue-logic in commercial embedded products using its 13,824 logic elements and 154 I/O.
- Consumer Electronics — Supports feature integration and peripheral interfacing in consumer devices within the device’s commercial temperature and supply ranges.
- Communications Equipment — Provides mid-level logic capacity and on-chip RAM for packet buffering, protocol processing, and interface management.
- Prototyping & Development — Offers a compact surface-mount package and substantial logic resources for proof-of-concept designs and evaluation boards.
Unique Advantages
- High Logic Capacity: 600,000 gates and 13,824 logic elements enable implementation of substantial digital functions without external CPLDs or additional FPGAs.
- On-Chip Memory: Approximately 0.11 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
- Generous I/O: 154 I/O pins allow broad peripheral connectivity and flexible board-level partitioning.
- Compact Surface-Mount Package: 208-BFQFP (28 × 28) provides a space-efficient footprint for PCB designs.
- Defined Power Envelope: Narrow supply range (1.425 V–1.575 V) simplifies power supply planning for core rails.
- Compliance Ready: RoHS compliance supports lead-free manufacturing flows.
Why Choose A3P600-1PQ208?
The A3P600-1PQ208 from Microchip Technology positions itself as a practical choice for designers seeking a commercially graded FPGA with substantial logic and I/O resources. Its combination of 600,000 gates, 13,824 logic elements, and on-chip memory supports integration of complex control, interfacing, and buffering functions in a single device.
This device is well suited to commercial embedded and consumer applications that require predictable operating ranges, a compact 208-BFQFP surface-mount package, and RoHS compliance. Choose the A3P600-1PQ208 when you need reliable mid-range FPGA capacity with clear electrical and thermal characteristics for production designs and development projects.
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