A3P600-1FGG484I

The A3P600-1FGG484I is a ProASIC3 FPGA offering a balance of logic capacity, on-chip memory, and I/O density in a compact 484-FPBGA (23×23) package. With 13,824 logic elements and approximately 0.11 Mbits of embedded memory, it is designed for embedded and industrial applications that require significant programmable logic and a large number of I/O signals.

This device operates from a core voltage range of 1.425 V to 1.575 V, supports 235 I/O pins, and is specified for an operating temperature range of −40 °C to 100 °C, making it suitable for industrial environments where robust thermal performance is required. The part is RoHS compliant and supplied in a surface-mount package for automated assembly.

Key Features

• FPGA Core and Logic 13,824 logic elements provide the programmable logic resources needed to implement custom digital functions and moderate complexity designs.
• Embedded Memory Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for data buffering, state storage, and small memory structures within user logic.
• Gates and I/O 600,000 equivalent gates and 235 user I/O pins enable broad interfacing options and substantial logic capacity for mixed-signal and digital systems.
• Power Supply Core voltage specified between 1.425 V and 1.575 V to match system power domains and ensure predictable power behavior.
• Package & Mounting 484-FPBGA (23×23) package in surface-mount format provides a compact footprint for high-density board-level integration.
• Temperature & Grade Industrial-grade operation from −40 °C to 100 °C for deployment in demanding thermal environments.
• Regulatory RoHS compliant for environmental and manufacturing conformity.

Typical Applications

• Industrial Automation — Use the device’s industrial temperature rating and high I/O count for machine control, programmable logic tasks, and I/O-intensive automation subsystems.
• Communications Infrastructure — Implement protocol logic, interface aggregation, and signal routing using the available logic elements and 235 I/Os.
• Test and Measurement — Deploy in instrumentation designs that require customizable digital processing, on-chip RAM for buffering, and a compact BGA package for dense PCBs.

Unique Advantages

• Substantial Logic Density: 13,824 logic elements enable implementation of complex combinational and sequential logic without external glue logic.
• Sufficient On-Chip Memory: Approximately 0.11 Mbits of embedded RAM supports local buffering and state machines, reducing external memory needs for many applications.
• High I/O Count: 235 I/O pins provide flexibility for multiple interfaces, sensors, and peripheral connections directly to the FPGA.
• Industrial Thermal Range: Specified operation from −40 °C to 100 °C allows deployment in harsher environments common in industrial systems.
• Compact, Assembly-Friendly Package: 484-FPBGA (23×23) surface-mount package supports automated PCB assembly while conserving board area.
• RoHS Compliant: Meets common environmental compliance requirements for modern manufacturing.

Why Choose A3P600-1FGG484I?

The A3P600-1FGG484I positions itself as a practical choice for engineers seeking a balance of logic capacity, embedded memory, and high I/O in an industrial-grade FPGA. Its 13,824 logic elements and 600,000-gate equivalence make it suitable for mid‑range programmable logic tasks while the 235 I/Os and 484-FPBGA package simplify integration on space-constrained, high-density boards.

For projects that require predictable thermal performance and compliance with environmental manufacturing standards, this ProASIC3 device delivers a combination of programmability and robustness appropriate for industrial automation, communications, and test equipment designs.

Request a quote or submit an inquiry to obtain pricing and lead-time information for the A3P600-1FGG484I and to discuss how it fits your next design.