A3P600-1FGG484

The A3P600-1FGG484 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology, delivered in a 484-ball BGA package. It provides a balance of programmable logic, on-chip memory and I/O capacity for compact commercial electronic designs.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 235 user I/O pins, this device targets applications that require moderate logic density, substantial connectivity and a compact surface-mount package.

Key Features

• Core Logic  Provides 13,824 logic elements (cells) and an equivalent of 600,000 gates to implement custom digital logic and control functions.
• Embedded Memory  Includes 110,592 bits of on-chip RAM—approximately 0.11 Mbits—suitable for buffering, small FIFOs and state memory.
• I/O Capacity  235 user I/O pins support flexible interfacing and parallel connectivity in a single device.
• Power  Operates from a core voltage supply range of 1.425 V to 1.575 V to match system power rails.
• Package and Mounting  Supplied in a 484-ball FPBGA (23 × 23) surface-mount package, package case 484-BGA, for compact board-level integration.
• Temperature and Grade  Commercial grade device specified for an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant construction for regulatory environmental conformity.

Typical Applications

• Embedded control and glue logic  Implement custom control paths, state machines and protocol conversion using the device’s logic elements and abundant I/O.
• Prototyping and development  Use the programmable fabric and on-chip memory to validate hardware designs and iterate system logic before production.
• Interface and I/O expansion  Add parallel and serial interfaces or consolidate multiple I/O functions into a single package for space-constrained designs.

Unique Advantages

• Moderate logic density: 13,824 logic elements enable implementation of substantial custom logic without requiring large FPGA families.
• Significant I/O count: 235 user I/Os allow flexible connection to peripherals, sensors and external devices in a single device.
• Compact BGA footprint: 484-FPBGA (23×23) package minimizes board area while delivering high pin count for dense designs.
• Controlled power envelope: Narrow core voltage range (1.425 V–1.575 V) simplifies power supply design and rail selection.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet standard commercial environment requirements.
• RoHS compliance: Environmentally compliant manufacturing and materials.

Why Choose A3P600-1FGG484?

The A3P600-1FGG484 delivers a balanced FPGA solution for commercial designs that need moderate logic capacity, substantial I/O and on-chip memory in a compact BGA package. Its specification set—13,824 logic elements, approximately 0.11 Mbits of embedded RAM, 235 I/Os and a 484-ball FPBGA footprint—makes it suitable for board-level integration where space and connectivity are priorities.

Manufactured by Microchip Technology, this ProASIC3 device provides a defined operating voltage range and commercial temperature rating, offering predictable electrical and thermal behavior for long-term deployments in commercial electronic products.

Request a quote or submit an inquiry to purchase the A3P600-1FGG484 and discuss availability and pricing for your design requirements.