A3P600-1FGG144I

The A3P600-1FGG144I is a ProASIC3 field programmable gate array (FPGA) offering reprogrammable digital logic capacity in a compact 144-LBGA package. It provides approximately 13,824 logic elements (about 600,000 gates), embedded on-chip memory, and a 97-pin I/O complement designed for applications that require configurable logic, on-chip RAM, and industrial-temperature operation.

With a nominal core supply range of 1.425 V to 1.575 V and an operating temperature range from -40 °C to 100 °C, this device targets designs where integration, deterministic hardware customization, and extended thermal range are important.

Key Features

• Core Logic Approximately 13,824 logic elements providing roughly 600,000 usable gates for custom digital implementations.
• Embedded Memory Approximately 110,592 bits of on-chip RAM to support buffer storage, state machines, and small data tables without external memory.
• I/O Count 97 general-purpose I/Os to interface with external peripherals and system buses.
• Supply Voltage Core supply range of 1.425 V to 1.575 V to match system power-rail requirements.
• Package & Mounting 144-LBGA (supplier package: 144-FPBGA, 13×13) surface-mount package for compact board-level integration.
• Temperature & Grade Industrial-grade device specified for operation from -40 °C to 100 °C.
• Regulatory Status RoHS compliant.

Typical Applications

• Custom digital logic — Reconfigurable hardware implementations that require a moderate number of logic elements and on-chip RAM for control and processing tasks.
• Embedded systems — Integration of configurable interfaces and peripheral control using the device's 97 I/Os and embedded memory.
• Industrial electronics — Systems that benefit from an industrial operating temperature range and surface-mount, space-efficient LBGA packaging.

Unique Advantages

• High logic density: Approximately 13,824 logic elements (~600,000 gates) enable substantial functional integration on a single device, reducing board-level complexity.
• On-chip memory: Approximately 110,592 bits of embedded RAM reduce dependency on external memory for control and buffering tasks.
• Generous I/O: 97 I/Os provide flexibility to connect multiple peripherals and system interfaces without additional bridging components.
• Industrial temperature rating: Specified operation from -40 °C to 100 °C supports deployment in thermally challenging environments.
• Compact, surface-mount package: 144-LBGA (144-FPBGA, 13×13) supports space-constrained board layouts while maintaining robust soldered connections.
• Environmental compliance: RoHS compliance supports regulatory and manufacturing requirements.

Why Choose A3P600-1FGG144I?

The A3P600-1FGG144I combines substantial programmable logic capacity and embedded memory in a compact, industrial-temperature LBGA package. Its balance of logic elements, on-chip RAM, and 97 I/Os makes it well suited for designs that require flexible hardware customization without extensive external components.

For design teams and procurement professionals focused on integration and temperature robustness, this ProASIC3 device delivers a practical platform for mid-density reprogrammable implementations while meeting RoHS requirements.

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