A3P600-1FGG256

IC FPGA 177 I/O 256FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 177 110592 256-LBGA

Quantity 585 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O177Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of A3P600-1FGG256 – ProASIC3 Field Programmable Gate Array (FPGA) IC 177 110592 256-LBGA

The A3P600-1FGG256 is a ProASIC3 family FPGA from Microchip Technology designed for commercial embedded applications. It integrates 13,824 logic elements and approximately 600,000 gates with about 110,592 bits of on-chip RAM to support complex logic and data buffering in a compact 256-LBGA package.

This surface-mount device provides 177 I/O pins and operates from a 1.425 V to 1.575 V supply within a commercial temperature range of 0 °C to 85 °C, making it suitable for a wide range of standard electronic designs requiring moderate logic density and on-chip memory.

Key Features

  • Logic Capacity — 13,824 logic elements delivering approximately 600,000 gates to implement medium-complexity digital designs.
  • Embedded Memory — Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for data storage and buffering within the FPGA fabric.
  • I/O Resources — 177 available I/O pins to support multiple peripheral interfaces and board-level connections.
  • Power Supply — Single supply operation in the range of 1.425 V to 1.575 V for the core.
  • Package & Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount mounting for compact PCB integration.
  • Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
  • Environmental Compliance — RoHS compliant.

Unique Advantages

  • High logic density: 13,824 logic elements and roughly 600,000 gates provide the capacity to consolidate logic that would otherwise require multiple discrete components.
  • On-chip memory for buffering: Approximately 0.11 Mbits of embedded RAM supports local data storage and state retention without external memory.
  • Robust I/O count: 177 I/O pins enable flexible interfacing options for peripherals, sensors, and board-level signals.
  • Compact surface-mount package: 256-LBGA (256-FPBGA, 17×17) minimizes PCB footprint while maintaining a high pin count for complex routing.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments.
  • Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose A3P600-1FGG256?

The A3P600-1FGG256 balances substantial logic and memory resources with a compact 256-LBGA footprint, making it a practical choice for commercial embedded designs that require medium-level logic integration and on-chip buffering. With 13,824 logic elements, roughly 600,000 gates, and 177 I/O pins, it enables designers to reduce board-level component count while maintaining flexible interfacing.

Manufactured by Microchip Technology and offered as a surface-mount, RoHS-compliant device with a defined commercial temperature range and a low-voltage core, this FPGA is well-suited for product designs focused on space efficiency, integration, and predictable commercial-environment operation.

Request a quote or submit an inquiry to receive pricing and availability for the A3P600-1FGG256.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up