A3P600-1FGG256
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 177 110592 256-LBGA |
|---|---|
| Quantity | 585 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 177 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of A3P600-1FGG256 – ProASIC3 Field Programmable Gate Array (FPGA) IC 177 110592 256-LBGA
The A3P600-1FGG256 is a ProASIC3 family FPGA from Microchip Technology designed for commercial embedded applications. It integrates 13,824 logic elements and approximately 600,000 gates with about 110,592 bits of on-chip RAM to support complex logic and data buffering in a compact 256-LBGA package.
This surface-mount device provides 177 I/O pins and operates from a 1.425 V to 1.575 V supply within a commercial temperature range of 0 °C to 85 °C, making it suitable for a wide range of standard electronic designs requiring moderate logic density and on-chip memory.
Key Features
- Logic Capacity — 13,824 logic elements delivering approximately 600,000 gates to implement medium-complexity digital designs.
- Embedded Memory — Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for data storage and buffering within the FPGA fabric.
- I/O Resources — 177 available I/O pins to support multiple peripheral interfaces and board-level connections.
- Power Supply — Single supply operation in the range of 1.425 V to 1.575 V for the core.
- Package & Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount mounting for compact PCB integration.
- Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- High logic density: 13,824 logic elements and roughly 600,000 gates provide the capacity to consolidate logic that would otherwise require multiple discrete components.
- On-chip memory for buffering: Approximately 0.11 Mbits of embedded RAM supports local data storage and state retention without external memory.
- Robust I/O count: 177 I/O pins enable flexible interfacing options for peripherals, sensors, and board-level signals.
- Compact surface-mount package: 256-LBGA (256-FPBGA, 17×17) minimizes PCB footprint while maintaining a high pin count for complex routing.
- Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments.
- Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.
Why Choose A3P600-1FGG256?
The A3P600-1FGG256 balances substantial logic and memory resources with a compact 256-LBGA footprint, making it a practical choice for commercial embedded designs that require medium-level logic integration and on-chip buffering. With 13,824 logic elements, roughly 600,000 gates, and 177 I/O pins, it enables designers to reduce board-level component count while maintaining flexible interfacing.
Manufactured by Microchip Technology and offered as a surface-mount, RoHS-compliant device with a defined commercial temperature range and a low-voltage core, this FPGA is well-suited for product designs focused on space efficiency, integration, and predictable commercial-environment operation.
Request a quote or submit an inquiry to receive pricing and availability for the A3P600-1FGG256.

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