A3P600-1PQG208I

The A3P600-1PQG208I is a ProASIC3 Field Programmable Gate Array (FPGA) IC provided in a 208-BFQFP package. It delivers a balanced combination of logic capacity, embedded memory, and I/O density for industrial-grade applications that require reliable programmable logic in a surface-mount package.

With 13,824 logic elements, approximately 110,592 bits of on-chip RAM and 154 user I/Os, the device is suited to designs that need mid-range FPGA resources along with defined operating and power supply envelopes for robust integration.

Key Features

• Core Logic  13,824 logic elements (CLBs) providing the primary programmable resources for custom digital logic implementations.
• Embedded Memory  Approximately 110,592 bits of on-chip RAM for data buffering, state storage and small lookup tables.
• Gate Count  600,000 gates indicating the device's overall integration capability for combinational and sequential designs.
• I/O  154 user I/O pins supporting a variety of external interfaces and board-level interconnects.
• Power Supply  Core supply range specified at 1.425 V to 1.575 V to align with system power planning.
• Package & Mounting  208-BFQFP (208-PQFP, 28×28) package in a surface-mount form factor for PCB assembly compatibility.
• Industrial Grade & Temperature Range  Rated for industrial operation with an operating temperature range of -40 °C to 100 °C.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Industrial systems  Use in industrial-grade designs that require operation over -40 °C to 100 °C and dependable programmable logic resources.
• Embedded logic integration  Implement custom digital functions using 13,824 logic elements and on-chip RAM for localized data storage.
• I/O‑centric designs  Deploy where up to 154 user I/Os are needed to interface with sensors, peripherals or board-level signals in a 208-BFQFP package.

Unique Advantages

• Balanced logic and memory  A combination of 13,824 logic elements and ~110,592 bits of RAM provides flexible resource allocation between compute and storage.
• Defined power envelope  A specific core voltage range (1.425 V to 1.575 V) helps simplify power-supply design and integration.
• Industrial temperature capability  Rated from -40 °C to 100 °C for deployment in temperature-challenging environments.
• High I/O density  154 I/Os in a compact 208-BFQFP package enables rich board-level connectivity without moving to a larger package type.
• RoHS compliant  Manufactured to RoHS standards to support regulatory and environmental requirements.

Why Choose A3P600-1PQG208I?

The A3P600-1PQG208I positions itself as a robust industrial-grade FPGA option that combines mid-range logic capacity, substantial on-chip memory, and significant I/O count in a 208-BFQFP surface-mount package. Its defined power-supply range and extended operating temperature make it a practical choice for engineers designing reliable programmable logic into industrial and embedded systems.

This device is well suited for designs that require a clear balance between logic resources, embedded RAM and I/O, while maintaining predictable electrical and thermal characteristics for long-term deployment.

Request a quote or submit an inquiry for the A3P600-1PQG208I to receive pricing and availability information tailored to your project needs.